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2025/05/09 PR
構造計画研究所HD(208)を今から買って大丈夫か？不安要素はいくつかあります…。
- 株式投資の世界で勝ち続けるためには、「銘柄の選定」と「銘柄の売買タイミング」が大事です。適当な銘柄選定では勝てませんし、売買タイミングを誤ってしまうと…
- https://exiv.ne.jp/
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2025/04/09
値上がり予想銘柄3（不定期）（2025,4,9)
- 値上がり予想銘柄3 208A 構造計画研究所ホールディングス 2811 カゴメ 2852 iシェアーズ_グリーンJリート_ETF 2855 グローバルX_グリーン・J-REIT_ETF 3091 ブロンコビリー 3121 マーチャント・バンカーズ 3480 ジェイ・エス・ビ...
- https://kabu-chan11.muragon.com/entry/6632.html
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2025/03/12
東証スタンダード（大引け）＝値上がり優勢、東海リース、サンオータスが買われる
- 12日大引けの東証スタンダード市場は値上がり銘柄数920、値下がり銘柄数438と、値上がりが優勢だった。 個別では植木組、構造計画研究所ホールディングス、オーシャンシステム<3096&g
- https://stock.f-frontier.com/2025/03/12/209200/
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2025/03/12
東証スタンダード（前引け）＝値上がり優勢、東海リース、サンオータスが買われる
- 12日前引けの東証スタンダード市場は値上がり銘柄数860、値下がり銘柄数411と、値上がりが優勢だった。 個別では植木組、構造計画研究所ホールディングス、オーシャンシステム<3096&g
- https://stock.f-frontier.com/2025/03/12/209182/
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【2ch】市況1板、株式板の反応（新着順）
スポンサード リンク
【速報】急騰・急落銘柄報告スレ18306 より
952 :山師さん＠トレード中 ：2025/05/09(金)19:19:22 ID:pfEC0kac0.net
【速報】急騰・急落銘柄報告スレ18304 より
825 :山師さん＠トレード中 ：2025/05/09(金)09:17:15 ID:ZBBuujGE0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
37360円37360円37360円37360円37360円
37360円37360円37360円37360円37360円
37360円37360円37360円37360円37360円
37360円37360円37360円37360円37360円
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37360円37360円37360円37360円37360円
37360円37360円37360円37360円37360円
37360円37360円37360円37360円37360円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18302 より
856 :山師さん＠トレード中 ：2025/05/08(木)13:36:48 ID:Vrl7EhAM0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
37000円37000円37000円37000円37000円
37000円37000円37000円37000円37000円
37000円37000円37000円37000円37000円
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37000円37000円37000円37000円37000円
37000円37000円37000円37000円37000円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18299 より
285 :山師さん＠トレード中 ：2025/05/07(水)09:25:06 ID:FftXpgg50.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
36800円36800円36800円36800円36800円
36800円36800円36800円36800円36800円
36800円36800円36800円36800円36800円
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36800円36800円36800円36800円36800円
36800円36800円36800円36800円36800円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18291 より
417 :山師さん＠トレード中 ：2025/05/02(金)09:17:26 ID:mNwyTgkl0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
36760円36760円36760円36760円36760円
36760円36760円36760円36760円36760円
36760円36760円36760円36760円36760円
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36760円36760円36760円36760円36760円
36760円36760円36760円36760円36760円
★決済の日時とPRICEは非公表です
【急騰】今買えばいい株22241【石破減配祭り】 より
902 :山師さん：2025/04/30(水)14:46:39 ID:nx1NONJH.net
雑技のニュースきたぁ
Nathan @Nathan9983
14:45:50
証券口座乗っ取り、三菱UFJモルガンも確認 大手で9社目 - 日本経済新聞 nikkei.com/article/DGXZQO…
【速報】急騰・急落銘柄報告スレ18285 より
202 :山師さん＠トレード中 ：2025/04/30(水)09:10:41 ID:a0a1ZT9j0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
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35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18282 より
205 :山師さん＠トレード中 ：2025/04/28(月)14:17:55 ID:dpg8KI2y0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
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35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18278 より
388 :山師さん＠トレード中 ：2025/04/26(土)00:48:54 ID:s+c8u4o10.net
JAPAN WEIGHS IMPORTING MORE US CORN IN TARIFF NEGOTIATIONS - NIKKEI
日本、関税交渉で米国産トウモロコシの輸入拡大を検討 - 日本経済新聞
大豆とトウモロコシで許してもらえるんやろか(´・ω・｀)
【速報】急騰・急落銘柄報告スレ18275 より
795 :山師さん＠トレード中 ：2025/04/25(金)00:46:55 ID:ctQhwxTA0.net
JAPAN IS CONSIDERING INCREASE IN IMPORTS OF AMERICAN SOYBEANS TO HELP U.S. OFFSET LOSS OF EXPORTS TO CHINA - NIKKEI
日本、米国産大豆の輸入増を検討 中国への輸出減を補う - 日本経済新聞
納豆増産待ったなし(´・ω・｀)
【速報】急騰・急落銘柄報告スレ18274 より
354 :山師さん＠トレード中 ：2025/04/24(木)12:47:22 ID:IkTancqJ0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
★決済の日時とPRICEは非公表です
【急騰】今買えばいい株22220【関税撤廃思惑】 より
524 :山師さん：2025/04/24(木)05:56:27 ID:hj/ngPeu.net
ベッセント米財務長官、日本に「通貨目標求めず」ps://www.nikkei.com/article/DGXZQOCB23AKH0T20C25A4000000/
プラザ合意やらんとよ
【急騰】今買えばいい株22210【全無】 より
947 :山師さん：2025/04/22(火)12:15:23 ID:/WxXsUim.net
補償対応を指示」証券口座乗っ取り受け 加藤金融相
//www.nikkei.com/article/DGXZQOUB221T10S5A420C2000000/
証券会社大損w
減益必至か？w
【急騰】今買えばいい株22213【修正】 より
20 :山師さん：2025/04/22(火)10:03:33 ID:qYz2zeDq.net
低位株さようなら
東証、名ばかり｢グロース｣に新基準 時価総額100億円未満は廃止
s://www.nikkei.com/article/DGXZQOUB17B0V0X10C25A4000000/
【速報】急騰・急落銘柄報告スレ18268 より
263 :山師さん＠トレード中 ：2025/04/22(火)09:48:08 ID:Rr435rSC0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
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34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
★決済の日時とPRICEは非公表です
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん：2025/04/21(月)22:53:54 ID:fbXSdLse.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん：2025/04/21(月)22:51:37 ID:HQwTJw7C.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん：2025/04/21(月)22:51:14 ID:N5bUdpKO.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん：2025/04/21(月)22:51:03 ID:+p5wlGn+.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん：2025/04/21(月)22:50:11 ID:rwHZuuRz.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【速報】急騰・急落銘柄報告スレ18265 より
157 :山師さん＠トレード中 ：2025/04/21(月)09:15:52 ID:Yh09BF960.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
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★決済の日時とPRICEは非公表です
【急騰】今買えばいい株22200【パヒューム】 より
712 :山師さん：2025/04/18(金)14:40:25 ID:3H7xwlKs.net
もらいまくりだ！s://article-image-ix.nikkei.com/https%3A%2F%2Fimgix-proxy.n8s.jp%2FDSXZQO6285218018042025000000-1.jpg?ixlib=js-3.8.0&w=1276&h=852&auto=format%2Ccompress&fit=crop&bg=FFFFFF&s=1d71ff501bc4c6ea82c088c55e2f380b
板別にレスを表示する
Yahoo掲示板（Y板）の反応（新着順）
スポンサード リンク
2025/05/09(金) 18:17:00投稿者:ミミイカ
3Q決算発表は今のところ、5月12日.時刻未定のようです。
2025/04/23(水) 17:36:00投稿者:NIN
連売り連買いばかりでボラ大きいなあ…
2025/04/22(火) 08:56:00投稿者:72e*****
寄り付き気配弱いけどなんかあった？
買っていいやつ？
2025/04/20(日) 07:03:00投稿者:関西同盟
地震銘柄。明日も上がるやろね。
2025/04/17(木) 13:42:00投稿者:bon*****
誤発注？
2025/04/16(水) 07:59:00投稿者:ゼクスメン
確かに下がっても荒れないしね
余裕のある人多いのかな
2025/04/14(月) 12:00:00投稿者:Voyage
急騰している？「持株会社化前含め上場後初の上期黒字」のせい。理由はわからない。２分割したが、来年さらに分割してもらわないと買いにくい。
2025/04/11(金) 20:18:00投稿者:トップ引き
ここのホルダーの質は、全銘柄でも指折りじゃないでしょうか
2025/04/11(金) 14:13:00投稿者:hac*****
日経平均が大暴落の中での、急上昇はきっと何かある。
2025/04/08(火) 21:32:00投稿者:Cantaloupeisland
そうですね、インフレが続く可能性はありますね。
アメリカは特にどうなるかわからないと思います。
一方でこと日本に関しては現状、コストプッシュインフレだと思いますので、
円高に振れる、また、アメリカ関税で景気後退懸念、アメリカ以外の国でモノが安くなる（消費が減るので供給過剰となる）可能性もあると思います。
いずれにせよ、ホルダーとしては会社が上手く取り廻してくれるよう、楽しみに待ちたいですね。
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数百人でいいのかな(´・ω・｀)