5243note(株)
市場:東証GRT
業種:情報通信業
Note Incは、主にメディアプラットフォームの開発に従事する日本に拠点を置く会社です。同社は主にメディアプラットフォームノートを運営しています。ここでは、作成者がテキスト、漫画、写真、オーディオ、ビデオなどのコンテンツを自由に投稿および販売し、ユーザーはコンテンツを楽しんでサポートし、購読できます。さらに、メモのプラットフォームを利用しながら、同社はまた、企業が自分の元のサイトとして情報を送信できるようにする機能を拡張するメディアサービス(SAAS)としてのソフトウェアであるNote Proも運営しています。コーポレートサービスビジネスは、メモに関するコーポレートが後援するコンテストを定期的に開催し、イベントを管理しています。メモコンテンツの外部分布などの二次使用からの収入は、他のビジネスで記録されました。
関連: 2022年のIPO/インターネット/営業・販売支援/SaaS/Webサイト構築/eコマース/ソーシャルメディア/C2C/サブスクリプション/人工知能
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- 【2ch】市況1/株式板(5ch)
- 【Yahoo】ファイナンス掲示板
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- [5243]note 株式掲示板
関連ブログ情報 新着リスト
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2025/04/25 PR note(5243)を今から買って大丈夫か?不安要素はいくつかあります…。
- 株式投資の世界で勝ち続けるためには、「銘柄の選定」と「銘柄の売買タイミング」が大事です。適当な銘柄選定では勝てませんし、売買タイミングを誤ってしまうと…
- https://exiv.ne.jp/
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2025/04/06 決算発表前にnoteさんの決算を予想してみました。
- #決算発表前に語ろう 今noteさんがこんなハッシュタグでキャンペーンされています。 そこでわたしも noteさんの決算予想してみました。 まずは 株探のサイトで調べて note(ノート)【5243】の業績・財務推移[通期・半期・四半期]|株探(かぶたん) note(ノート)【5243】の業績分析ができる多様な決算情報を掲載。決算発表と業績修正はリアルタイムで更新。通期は5期、 kabutan.jp 昔は赤字だったのですが、 どんどん利益が上がってきているのです。 やっぱりGoogleとの資本提携も 大きいのではないでしょうか? それから株価は爆上が
- https://note.com/bookrabbit4646/n/n5354d217906a
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2025/03/27 S高くるか? note(5243)の株価急上昇に迫る! - 2025/03/27
- なぜ、最近note(5243)の株価は急騰しているのでしょうか?その理由を徹底検証!ここまで株価が上がった経緯を、日足チャートと、ニュース、ブログ、掲示板での反応と共に振り返ります。2025/03/17(月曜日)前日比:+5.2%この日のニュースnoteが大幅続伸、「noteマ
- https://rizumunet.blog.jp/archives/1084396637.html
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2025/03/17 NOTE : 5243
- グーグルと提携という話題に沸き、1月に急騰した NOTE 株だが、買われ過ぎたか 最高値付近で大量に売られたかで、最高値から 売れなくなったまま 3連続S( ストップ)安になり、株価は高値から 半値に下がってしまった。 最高値で買っていたら資産は ー50%に。 経営者の持ち...
- https://study001.muragon.com/entry/4315.html
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【2ch】市況1板、株式板の反応(新着順)
スポンサード リンク
【速報】急騰・急落銘柄報告スレ18275 より
35 :山師さん@トレード中 :2025/04/24(木)15:37:19 ID:ILHF5sc60.net
【速報】急騰・急落銘柄報告スレ18275 より
19 :山師さん@トレード中 :2025/04/24(木)15:32:27 ID:ILHF5sc60.net
乙、ココナラとnoteのお陰で年初来+8.08%まで回復(´・ω・`)
【速報】急騰・急落銘柄報告スレ18274 より
682 :山師さん@トレード中 :2025/04/24(木)14:15:03 ID:Z5ZVr2Pu0.net
yesかnote!!(`・ω・)(・ω・`)
【速報】急騰・急落銘柄報告スレ18274 より
667 :山師さん@トレード中 :2025/04/24(木)14:08:47 ID:ILHF5sc60.net
ココナラゴールしたからnote入ってみたけどこっちもあがってるわ(´・ω・`)
【急騰】今買えばいい株22222【にゃんにゃん】 より
420 :山師さん:2025/04/24(木)09:48:15 ID:1iK9JZV8.net
noteまだやっててワロタ 材料グーグルでしょ?
【速報】急騰・急落銘柄報告スレ18272 より
381 :山師さん@トレード中 :2025/04/23(水)15:40:09 ID:xr0oqR4i0.net
ココナラ、noteが9.3%取得
(´・ω・`)
【速報】急騰・急落銘柄報告スレ18268 より
82 :山師さん@トレード中 :2025/04/22(火)09:17:12 ID:GfWNXWIxH.net
noteマネーってサイトが出来てた(´・ω・`)
【急騰】今買えばいい株22209【リクスー女の尻を】 より
251 :山師さん:2025/04/22(火)08:40:25 ID:d5oF05u4.net
noteに投稿したら対価としてお金貰えるIR来てるぞ
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん:2025/04/21(月)22:53:54 ID:fbXSdLse.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん:2025/04/21(月)22:51:37 ID:HQwTJw7C.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん:2025/04/21(月)22:51:14 ID:N5bUdpKO.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん:2025/04/21(月)22:51:03 ID:+p5wlGn+.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん:2025/04/21(月)22:50:11 ID:rwHZuuRz.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【速報】急騰・急落銘柄報告スレ18264 より
318 :山師さん@トレード中 :2025/04/19(土)21:25:40 ID:ajx4JdRa0.net
最新かは知らない(´・ω・`)
2chMate 0.8.10.211/Xiaomi/Redmi Note 9S/12/GR
板別にレスを表示する
Yahoo掲示板(Y板)の反応(新着順)
スポンサード リンク
2025/04/25(金) 07:02:00投稿者:fyu*****
自分で自分の都合を市場に押し付けているのに驚きます
買うまでは下がれ 下がれ と心の中で叫び、
買ったとたんに上がれ 上がれ と
自分自身勝手なものです
https://kabufx.space/news?qbiw
2025/04/25(金) 07:02:00投稿者:IPO迷人
漏れてたのか。。
機関は買い戻してたのね。
そして、また高菜で故人が掴まされる。
2025/04/25(金) 06:06:00投稿者:TKGファンド
これより、えなこ大好きアタック開始する!
総員!買いで援護しろ!
2025/04/25(金) 05:48:00投稿者:い
日経先物調子良し、グーグル好決算、今日もたのんます
2025/04/25(金) 05:47:00投稿者:kaniel otiz
大した材料もないのに昨日爆上げしたから今日は爆下げ
株とはそうゆうもの
2025/04/25(金) 04:02:00投稿者:Yahoo!ファイナンス掲示板
2025/04/25に作成されたnote(株)について話し合うスレッドです。
スレッドのテーマと無関係のコメント、もしくは他にふさわしいスレッドがあるコメントは削除されることがあります。
Yahoo!ファイナンスの株式、金融、投資に関するスレッドに参加する場合は、LINEヤフー共通利用規約を再読してください。
LINEヤフー株式会社は情報の内容や正確さについて責任を負うことはできません。
その種の情報に基づいて行われた取引や投資決定に対しては、LINEヤフー株式会社は何ら責任を負うものではありません。
■一つ前のスレッド
『note(株) 2025/04/18〜2025/04/24』
https://finance.yahoo.co.jp/cm/message/1835700/c3f41e3eda5b067f4c6fc2bf21ef374b/52
2025/04/25(金) 02:40:00投稿者:goi*****
★アメリカトランプは
既に死に体だね!口から出任せばかり最悪、頭の中が 混乱政策してるね可成悩んでる顔つきだよね昨今は。駄目なアメリカだよ!
>アメリカのトランプ政権による関税政策の停止を求めて、ニューヨーク州など12の州が裁判を起こしました。
トランプ終了、年内で解任されるんじゃないか?
その後は相場操縦でふだ、ばこ行きで
2025/04/25(金) 02:26:00投稿者:ちゃんどら。
|•'-'•)وナイス!
2025/04/25(金) 00:18:00投稿者:ランチ
何があったか知らないけど嬉しい
2025/04/25(金) 00:09:00投稿者:もぐ
+16.5%かすさまじいな
つぎにこうなるのはタイミーだと思うわ
twitter検索
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ir_agents
【更新報告】
5243 note 様の取材ノートが公開されました!
取材ノートページ (会員様用) はこちら!
https://t.co/57X6Yw63r3 |
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takfujimaki
→ 2023/07/12
note (5243) 大幅に5日続落
終値 474円 (↓) -32 -6.32%
高値 507円 (09:06)
安値 473円 (14:46)
出来高 376,700
売買代金 183,13… https://t.co/8RmN2VK5P5 |
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karauriNET
Merrill Lynch internationalの空売り残高(7/7)
5243 note -0.03%
5341 ASAHI EITOホールディングス -0.15%
5408 中山製鋼所 +0.01%
5563 新日本電… https://t.co/pQcPnDOYax |
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gatery6y
5243 note
国内有力証券が投資判断「バイ」継続で、
目標株価を引き上げ、
買い材料視されている。
https://t.co/TNliPCxSI7 |
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tdnet_popular
4571 ナノキャリア
4572 カルナバイオサイエンス
4575 キャンバス
4586 メドレックス
4591 リボミック
4594 ブライトパス
4598 デルタフライ
4599 ステムリム
4776 サイボウズ
4881 フ… https://t.co/e1xitVvO3F |
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RTKHY
5243 note 再イン‼️
来週は第二四半期決算です‼️ https://t.co/H11uQDX6J1 |
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kabudev_gc
7255 桜井製作所
7266 今仙電機製作所
6307 サンセイ
7434 オータケ
6743 大同信号
7345 アイ・パートナーズ
5541 大平洋金属
7063 Birdman
7918 ヴィアHD
7868 広済堂HD… https://t.co/ExamLEI10e |
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neet_rehabili
5243 note
強くなりそう |
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>>25
noteはそんなに買ってない…(´・ω・`)