4427(株)EduLab
市場:東証GRT
業種:情報通信業
Edulab Incは、主にテスト開発、実装、分析、英語およびその他のテストの教育サービスの提供に従事している日本を拠点とする企業です。同社は5つのセグメントを介して運営しています。テストおよびその他のライセンスセグメントは、教育機関、民間企業、個人に言語を中心としたテストサービスと学習サービスを提供します。教育プラットフォームセグメントは、Stagia Eiken、Stagia Kanken、Stagia Math Test、Media Servicesなどの学習サービスを提供および運営しています。テストセンターセグメントは、全国のテストセンターを確立し、さまざまな資格、認定試験、大学入学試験のテストセンターを提供しています。人工知能(AI)セグメントは、社内で研究および開発されたAIテクノロジーを使用してサービスと製品を提供します。テスト操作とアウトソーシングセグメントは、テストの質問の作成、システムの構築、管理、運用、およびスコアリングに関連するサービスを提供します。
関連: eラーニング/人工知能/教育ICT/2018年のIPO
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2025/04/22 PR 【4427】EduLabをまだ握ってる人は手離すべき?!最新技術と方法な知識で次世代型の投資戦略をご提案!
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2024/10/26 【4427】EduLab
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2024/07/10 7/11のデイトレード注目株銘柄
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【2ch】市況1板、株式板の反応(新着順)
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【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん:2025/04/21(月)22:53:54 ID:fbXSdLse.net
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん:2025/04/21(月)22:51:37 ID:HQwTJw7C.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん:2025/04/21(月)22:51:14 ID:N5bUdpKO.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん:2025/04/21(月)22:51:03 ID:+p5wlGn+.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん:2025/04/21(月)22:50:11 ID:rwHZuuRz.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【速報】急騰・急落銘柄報告スレ18240 より
809 :山師さん@トレード中 :2025/04/10(木)22:56:32 ID:GuqKReTS0.net
ビクター・ニーダーホッファー
The Education of a Speculator (1997年)
彼の投資哲学、市場に関する洞察、そして人生経験などを綴ったものです。
【速報】急騰・急落銘柄報告スレ18231 より
634 :山師さん@トレード中 :2025/04/09(水)00:44:08 ID:3rxSUVjb0.net
FinancialJuice
@financialjuice
US Trade Representative Greer: I want to open up other markets
for US beef to reduce dependence on China.
グリア米通商代表:中国への依存を減らすため、米国産牛肉のために他の市場を開拓したい。
板別にレスを表示する
Yahoo掲示板(Y板)の反応(新着順)
スポンサード リンク
2025/04/22(火) 13:09:00投稿者:ちくわ
東京証券取引所は22日午後の有識者会議で、新興企業が上場するグロース市場の新たな上場維持基準案を決める。上場から5年で株式時価総額が100億円に達しない企業は他の市場に移るか、上場廃止を迫られる。基準の達成に向けてグロース企業を対象としたM&A(合併・買収)が増える可能性がある。
そろそろ来るな
2025/04/21(月) 18:18:00投稿者:ppp*****
なんか?
やからやかんPTA出たん?
299円、55円高!
Sちかし、100均しか売りが無い?
2025/04/19(土) 22:13:00投稿者:emx
2025/04/19(土) 19:27:00投稿者:pig
残り500株、もう三年握ってるけど、辛いよ
2025/04/19(土) 13:54:00投稿者:ppp*****
開示でて!
だいぶ、あがっとるやんけ!
Sか!
2025/04/17(木) 14:35:00投稿者:右兵衛尉 米国個別株現物投資
9610が下がってきた
2025/04/16(水) 23:51:00投稿者:カ 出ない( リキ deny)
無償、無償、無償だ。
2025/04/15(火) 15:20:00投稿者:あきちん
なんじゃここもきゃwww(爆
2025/04/15(火) 15:08:00投稿者:あきちん
えどぅwww(爆
2025/04/15(火) 14:49:00投稿者:ppp*****
NHKでも、プライムタイムスペシャルニュースで、
小学生全国テスト
来年から、英語で、CBT本格導入されると
本格放映してました!
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kabudev_gc
6330 東洋エンジニアリング
3760 ケイブ
8143 ラピーヌ
7211 三菱自動車
4427 EduLab
3787 テクノマセマティカル
4080 田中化学研究所
5969 ロブテックス
4482 ウィルズ
6047 Gunosy
8228 マルイチ産商
他 62 銘柄 |
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seigo77
さらに浮上ありそうな銘柄
3691 デジプラス
4570 免疫生物研
4487 スペースM
3979 うるる
6040 日本スキー場
9258 CS-C
4427 EduLab
4486 ユナイト&G
4889 レナS |
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kabudev_dc
2023年07月05日 (水) 日足 株価↓100日移動平均線
6731 ピクセラ
4892 サイフューズ
5036 日本ビジネスシステムズ
4166 かっこ
3353 メディカル一光グループ
4422 VALUENEX
813… https://t.co/6pbYVgz5el |
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Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.