Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

🔴 Fox Source on X: White House Press Secretary says 104% additional tariffs went into effect at noon eastern time because China has not removed its retaliation. The 104% additional tariff will be collected starting tomorrow April 9th

🔴 Fox Source on X: ホワイトハウス報道官は、中国が報復措置を撤回していないため、東部時間正午に104%の追加関税が発効したと述べた。104%の追加関税は明日4月9日から徴収される。

Trump: "if China does not withdraw its 34% increase above their already long term trading abuses by tomorrow, April 8th, 2025, the United States will impose ADDITIONAL Tariffs on China of 50%, effective April 9th"
トランプ"中国が明日2025年4月8日までに、すでに長期にわたって行ってきた貿易の乱用を上回る34％の関税引き上げを撤回しない場合、米国は4月9日から中国に50％の追加関税を課す"

おうふ(´・ω・｀)

CBP already collecting ‘Liberation Day’ tariffs, pulling in over $200M per day in additional revenue
CBP says it’s working closely with other agencies as the tariffs roll out（FOX NEWS)

CBPはすでに「解放の日」の関税を徴収しており、1日あたり2億ドル以上の追加収入を引き出している
CBPは、関税が展開するにつれて他の機関と緊密に連携していると言います

まぁ、フォックスニュースなので、そこん所ヨロシク　(´・ω・`)

China announces additional tariff measures on US goods
中国、米国製品に対する追加関税措置を発表

報復合戦こたーー(´・ω・｀)