Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

気がついたら日本企業だけランク圏外に
https://i.imgur.com/aMdPPXK.jpeg

あぶないよ　今夜の半導体
米国の半導体株は夜間取引でも下落を続け、NvidiaとAMDは7.5%以上、BroadcomとASMLは5%以上、TSMCは4%近く下落した。

いまはaliexpressでバルク品のAMDのCＰＵを買うのが通らしい(´・ω・｀)

AMD米国生産始めたのか。やるではないか

>>550
原材料調達、設計、製造を一国でやりたいとか頭が悪いな
AMDは製造は割り切って設計に専念して業績を維持
。いまはジムケラーがおらん(´･ω･｀)

120パーセントだろうがAMD NVDA クアルコムなんて台湾生産なんだし中国向けには無税でよい(´･ω･｀)

( ･`ω･´)
中国、海外委託の米半導体は報復関税免除　ＡＭＤ・インテル株に明暗
https://news.yahoo.co.jp/articles/498e872bf49f2f52eb804dd259d49e4f29a4f8bf
ＴＳＭＣに製造を委託しているクアルコムやＡＭＤなどが設計した半導体については、
原産地を台湾として分類する予定という。

ＴＳＭＣの重要顧客であるＡＭＤとエヌビディアの株価は一時、それぞれ６％と２．６
％上昇した。クアルコムは１．１％高となった。

中国、海外委託の米半導体は報復関税免除　ＡＭＤ・インテル株に明暗

AMDの含み損が減っただけの1日になりそう…(´・ω・｀)

AMD普通に-5%なんやが(´・ω・`)なんのこっちゃやで

>>386
Amazon
Youtubeやgoogle
windowsマイクロソフト
amd
intel
netflex
スタバ
マクド
iPhoneやapple製品
コカ・コーラ
ディズニー
HP
アメリカ産肉、大豆、とうもろこし

軽く思いつくだけでもこんだけ買ってる

なんか今週凄い動きしてたんだな
法事で全くスマホ触れなくてノーポジだったせいか
NVとAMDで往復ビンタにうずくまったトコをサッカーボールキックされるくらいで済んだ
普通にやってたら少し安くなった重工山梨王アドバンソニー買ってた気がする…

値段的にsteamdeck買うならswitch2だな

やっす
steamdeck売るわ

steamdeck売るか

>>639
ハードだけなら似たスペックのSteamdeckが8万超えてるんだよなあ
暴力的な量産コストダウンがどこまできくのか

わしのAMDもマイテン寸前だ(´・ω・｀)

https://pbs.twimg.com/media/Gctye_ebcAMD0ki.jpg
現実になる…

半導体ザマーと思ってたらわしAMD持ってたんだった(´・ω・｀)

エヌビとか何が神の船だよ
グラボもクソ高い上に微妙だし
AMDのほうがいいわ

２０年くらい前の自作PC
AMDのCPUでサンダーバードを思い出した
OC全盛期だったな