Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Leveraged Long ETFs saw a weekly inflow of $6.6 Billion last week, the most in history 🚨🚨

レバレッジロングETFへの資金流入は先週、過去最高となる66億ドルに達した🚨🚨

https://image-tm.s2mr.jp/i/original/1745117542728.jpeg

メタプラネット（$MTPLF）が、OTCQX Billion+ Indexに採用されたことをお知らせします。

なにこれ

Billionaire Ray Dalio: ‘I’m worried about something worse than a recession’（CNBC）
億万長者レイ・ダリオ：「不況よりもっと悪いことを心配している」

ダリオのファンのインドマン、後は任せた　(´・ω・`)

>当日になっても非関税障壁を含めて対象国の関税率をどう計算するか決まらず、苦し紛れに貿易赤字額を輸入額で割って数字を決めたらしい。
>対日赤字$68.5 billion /輸入額$148.2=46%
>ディスカウント相互関税はそのおよそ半分で24%
>なぜ23%じゃないのかは不明。
ttps://x.com/tetsuo_kotani/status/1907590820339003708

この間きた共和党ブレーン
頭悪そうだったが・・・・・・・・

＞China blocks BlackRocks $23 billion deal to buy Panama Canal Ports.
これは始まりそうだな…