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521 :山師さん:2025/04/21(月) 22:50:11 ID:rwHZuuRz 【急騰】今買えばいい株22208【団鬼六】 より
295 :山師さん@トレード中 :2025/04/17(木) 17:21:27 ID:BgqoqIs60 【速報】急騰・急落銘柄報告スレ18260 より
FinancialJuice
@financialjuice
China March survey-based jobless rate for 16-24 years old, excluding college students
at 16.5% vs 16.9% in previous month - Stats Bureau.
中国3月の調査に基づく16~24歳の失業率(大学生を除く)は16.5%で、
前月の16.9%から低下した - 国家統計局。
低下したとしても、公表数字でこの数字だと、日本の就職氷河期の頃より悪いのね (´・ω・`)
304 :山師さん@トレード中 :2025/04/16(水) 18:01:00 ID:MX/KxDSB0 【速報】急騰・急落銘柄報告スレ18257 より
BOJ SET TO CUT GROWTH FORECAST FOR CURRENT FISCAL YEAR: RTRS
日銀、今年度の成長率予想を下方修正へ:RTRS
あんまり関係ないか(´・ω・`)
701 :山師さん@トレード中 :2025/04/15(火) 11:26:57 ID:vLjn/z0F0 【速報】急騰・急落銘柄報告スレ18252 より
>>686
Zero-day options are fueling the unprecedented volatility on Wall Street amid tariff chaos(CNBC)
ゼロデイ・オプションが、関税の混乱の中、ウォール街の空前のボラティリティに拍車をかけている
記事内
「The trading volume of 0DTE options tied to the S&P 500 surged to 8.5 million in April, a 23% jump since
the beginning of the year and accounting for roughly 7% of the total volume in U.S. option markets,
according to data from JPMorgan.」
JPモルガンのデータによると、S&P500に連動する0DTEオプションの4月の取引量は850万枚に急増し、
年初から23%急増し、米国オプション市場全体の取引量の約7%を占めた。
働くより、ギャンブルで一儲けや! ・・・なんて(´・ω・`)
488 :山師さん@トレード中:2025/04/15(火) 00:02:20 ID:iFbsMFNl0 【速報】急騰・急落銘柄報告スレ18251 より
The NY Fed survey shows one-year ahead inflation expectations rose to 3.6% in March from 3.1% in February
Three-year ahead inflation expectations held steady at 3%
Five-year ahead inflation expectations ticked down to 2.9% from 3%.
NY連銀の調査によると、3月の1年先のインフレ期待は3.6%と2月の3.1%から上昇
3年先のインフレ期待は3%で横ばい
5年先のインフレ期待は2.9%と3%から小幅に低下した。
NY民のインフレ観測は低いね(´・ω・`)
215 :山師さん@トレード中:2025/04/14(月) 21:04:41 ID:rkpB0GSn0 【速報】急騰・急落銘柄報告スレ18251 より
OPEC cuts oil demand forecast this year and next amid trade war.
OPEC、貿易戦争の中、今年と来年の石油需要見通しを下方修正。
あんまり下がってない(´・ω・`)
158 :山師さん@トレード中 :2025/04/11(金) 22:17:12 ID:IGaZhnfU0 【速報】急騰・急落銘柄報告スレ18245 より
🔴 Fed's Collins: Would expect inflation well over 3% this year due to tariffs.
FRBのコリンズ:関税の影響で今年のインフレ率は3%を大きく超えると予想する
ヅラのせいって言うてるがな(´・ω・`)
29 :山師さん@トレード中:2025/04/11(金) 02:15:04 ID:IGaZhnfU0 【速報】急騰・急落銘柄報告スレ18241 より
>>25
FinancialJuice
@financialjuice-
11分
US 30-YEAR BOND BID-TO-COVER ACTUAL 2.430 (FORECAST -, PREVIOUS 2.370)
この人のをみて書いた(´・ω・`)
774 :山師さん:2025/04/04(金) 10:05:02 ID:CTy21nBT 【急騰】今買えばいい株22112【雇用統計】 より
多分これはまだ周知されていないしな
NVIDIAもやばいんだよな
[ Nvidia GB300 Reference Design Has Not Been Finalized, High Likelihood of Delay ]
It is highly likely that the GB300 will be delayed for a release by the end of this year or next year.
? Nvidia is set to officially announce its high-end AI server, the GB300, at GTC 2025.
? The initial target is a Q3 2025 release.
? The current market anticipates a release delay?expected from late 2025 to early 2026?due to unresolved design decisions and supply chain issues.
? It is presumed that the design for the power-related solution has not yet been finalized.
? Considering that both JPM and Taiwanese media are reporting similarly, the potential delay is high and warrants close monitoring.
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Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.