EU Official: The EU is set to ban Russian gas spot contracts by the end of the year, gas spot contracts are defined as under one year.
EU当局者EUは年内にロシアのガススポット契約を禁止する予定である。

厳冬が来たらどうすんのやろ(´・ω・｀)オランダのガス田掘っちゃうか

would considerは共同通信社の希望的観測だろ
USサイドからはそんな話出てない

US REJECTS JAPAN 🇯🇵 FULL EXEMPTION FROM 'RECIPROCAL' TARIFFS; US WOULD CONSIDER LOWERING 14% JAPAN-SPECIFIC TARIFF: KYODO
米国、日本に対する『相互』関税の全面免除を拒否　米国は日本向けの14％の特別関税の引き下げを検討する可能性がある――共同通信

FinancialJuice
@financialjuice
Japan Economy Minister Akazawa: We are not thinking about sacrificing agricultural
products for the sake of autos in tariff negotiations
赤沢経財相：関税交渉において、自動車を理由に農産物を犠牲にすることは考えていない
参考
自民・食料安保本部「農水産品を犠牲にするな」決議を採択　森山幹事長「守るべきは守るという姿勢を徹底」
4/25(金)（TBS NEWS DIG Powered by JNN）

アメリカは、そんなに日本に都合良く話を受けてくれるのだろうか？　(´・ω・`)

AI GIJIROKUが提供開始されたのは2020年とコロナ禍の最中。リモートワークが普及したことで、議事録作成SaaSに注目が集まったことに加え、2023年から始まった生成AIブームの波に乗って急成長したと考えられます。同製品が含まれる「AI Products」事業の売上高は、全体の88％（今期前期）を占めており、今では同社の主軸事業となっています。
https://onecapital.jp/perspectives/alt-ipo#index_zamPNpQa

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【速報】 米国、中国に245％の関税　中国以外の国の高関税は一時停止 ★3
https://asahi.5ch.net/test/read.cgi/newsplus/1744805008/1
1: お断り ★ 2025/04/16(水) 21:03:28.69 ID:8nf12XOb9
Today, President Donald J. Trump signed an Executive Order launching an investigation into the national security risks posed by U.S. reliance on imported processed critical minerals and their derivative products.
本日、トランプ大統領は米国が加工された重要鉱物とその派生製品の輸入に依存していることがもたらす国家安全保障上のリスクについて調査開始する大統領令に署名を行った。

As a result, the individualized higher tariffs are currently paused amid these discussions, except for China, which retaliated.
報復措置を取った中国を除き、個別の高関税の導入は協議が続く中で現在一時停止している。

China now faces up to a 245% tariff on imports to the United States as a result of its retaliatory actions.
中国は報復措置の結果、米国への輸入品に最大245％の関税を課す。

ホワイトハウス公式 (現地時間)2025/4/15 ソース英語『Fact Sheet: President Donald J. Trump Ensures National Security and Economic Resilience Through Section 232 Actions on Processed Critical Minerals and Derivative Products』
https://www.whitehouse.gov/fact-sheets/2025/04/fact-sheet-president-donald-j-trump-ensures-national-security-and-economic-resilience-through-section-232-actions-on-processed-critical-minerals-and-derivative-products/

勝手に関税織り込んだことにして買ったアホwwwwwwwwww

🚨 EU EXPECTS US TARIFFS TO REMAIN AS TALKS MAKE LITTLE PROGRESS

🚨 EUは交渉がほとんど進展せず、米国の関税が維持されると予想

EU EXPECTS US TARIFFS TO REMAIN AS TALKS MAKE LITTLE PROGRESS
*欧州連合（EU）、協議はほとんど進展せず、EUの関税は維持されると予想

噂レベルぽいんだけど(´・ω・｀)

GOLDMAN CEO SAYS PROSPECTS OF A RECESSION HAVE INCREASED
ゴールドマン・サックスCEO：リセッション入りの見通しが高まった。

ガソリンスタンドめ(´・ω・｀)