shinseijapan

【恐るべき株】今急騰/急落している株、仕手株、低位株、思惑株、材料株など、今みんなが注目している銘柄をほぼリアルタイムでランキング化!個別株銘柄情報も口コミや掲示板など中心にまとめています。
【2ch】急騰株 急落株 仕手株 注目銘柄【Yahoo】ファイナンス掲示板(Y板)よりそれぞれの注目銘柄ランキングが表示され、 レス数ボタン・トピ数ボタンをクリックする事で最新銘柄口コミ情報が表示されます!気になる株式銘柄がある方は是非お試しください。 仕手・仕手株・仕手筋とは?

[お知らせ]
リアルタイム注目キーワードランキング をホームに設置しました。2ch市況1/株式板で今リアルタイムで話題の注目キーワードをご覧ください。 ※現在1位のキーワードは『日本』です
本日、仕手株として話題になっている銘柄は 仕手・仕手株 こちらの検索結果をご参考に。

【6083】ERIホールディングス【ERI】

1 : 管理人 : 2013/11/13(水) 04:30:07 ID:OwnerKabu685

[特色]-
[連結事業]【連結事業】確認検査60(10)、住宅性能評価および関連26(19)、他14(2)(2013.5)

前へ次へ

現在書き込みはありません。
ERIホールディングスを保有している方や思惑のある方は、ぜひ書き込みして行ってください!

ERIホールディングスの銘柄情報はコチラ→6083

[6083]ERIホールディングス 2ch&Yahoo板統合 新着口コミ情報

※コメントは常に更新されます

【速報】急騰・急落銘柄報告スレ18307 より

507 :山師さん@トレード中 :2025/05/10(土)07:13:41 ID:Ti49hL7l0

Make America Great Again

【速報】急騰・急落銘柄報告スレ18302 より

158 :山師さん@トレード中 :2025/05/08(木)10:27:32 ID:DNAC7Ybx0

・事前交渉は一切しない
・自分の理想(great なんたら america)を持ってるが実現への過程は周りに丸投げ
・自己の利益のためなら息を吐くように嘘をつく

【急騰】今買えばいい株22267【GW明け鬱】 より

529 :山師さん:2025/05/07(水)06:38:08 ID:pw/q9qjk

*TRUMP: 'EARTH-SHATTERING' ANNOUNCEMENT TO COME

トランプ氏「地球を揺るがすような衝撃的な発表がある」

やめろよ株に悪い

552 :山師さん:2025/05/07(水)06:55:24 CG27X64p

>>529
👽我々の紹介か

545 :山師さん:2025/05/07(水)06:52:34 UKXEUsJW

>>529
寂しいんやろな

532 :山師さん:2025/05/07(水)06:43:25 8HIKqiSs

>>529
ダウ10万超えるぞこれ…

【急騰】今買えばいい株22265【勃起】 より

799 :山師さん:2025/05/06(火)00:25:09 ID:LX7Tv8xv

would considerは共同通信社の希望的観測だろ
USサイドからはそんな話出てない

US REJECTS JAPAN 🇯🇵 FULL EXEMPTION FROM 'RECIPROCAL' TARIFFS; US WOULD CONSIDER LOWERING 14% JAPAN-SPECIFIC TARIFF: KYODO
米国、日本に対する『相互』関税の全面免除を拒否 米国は日本向けの14%の特別関税の引き下げを検討する可能性がある――共同通信

【急騰】今買えばいい株22258【修正】 より

962 :山師さん:2025/05/02(金)11:06:31 ID:4tcs/1u+

Xbox 大幅値上げ来たぁ~  \(^o^)/オワタ


・Xbox Series X 66978→87980円
・Xbox Series X(デジタル) 59978→79980円
・Xbox Series S(1TB) 49978→67480円

966 :山師さん:2025/05/02(金)11:07:19 X8MVMpzK

>>962
箱◯の日本市場オワタ

【速報】急騰・急落銘柄報告スレ18291 より

64 ::2025/05/02(金)03:51:17 ID:oM7ExTzD0

マイクロソフトゲーム機を値上げ
高級品へ 

Xbox、世界中で本体および周辺機器の価格を引き上げ

日本のXbox Series Xは約2万円値上げの8万7980円に

Microsoft公式より本日発表。米国でもXbox Series Xが100ドル値上げの599.99ドルに。ほか、11月末より一部の新作タイトルも79.99ドルに引き上げると予告 p

【急騰】今買えばいい株22248【ニギチン】 より

655 :山師さん:2025/05/01(木)13:36:35 ID:PYh5Whv6

6083貸借

【急騰】今買えばいい株22247【missAV】 より

76 :山師さん:2025/05/01(木)10:56:58 ID:YB2u6Tbc

テスタさんveri biziiみたいですね

【速報】急騰・急落銘柄報告スレ18287 より

505 :山師さん@トレード中 :2025/04/30(水)21:23:54 ID:i7+d2gwS0

Feeling in Damerica (´・ω・`) in Damerica〜♪

【速報】急騰・急落銘柄報告スレ18286 より

827 :山師さん@トレード中 :2025/04/30(水)15:14:28 ID:piMpsE490

Eric Trump: ‘If banks don’t watch what’s coming, they’ll be extinct in ten years’(CNBC)
エリック・トランプ:「銀行が今後起こることを注視しなければ、10年以内に絶滅するだろう」

・・・だそうです(´・ω・`)

861 :山師さん@トレード中 :2025/04/30(水)15:21:43 bg9nqFPu0

>>827
だいぶサイダーで儲けてるんだろうな、この一族(´・ω・`)

【急騰】今買えばいい株22239【魔の水曜日】 より

863 :山師さん:2025/04/30(水)10:09:38 ID:pCOHE0vA

The sound of the bell at Gion Shosha echoes the impermanence of all things. The color of the flowers of the sarasota tree reveals the truth that all things must decline. The proud do not last long, just like a dream on a spring night. The fiercest men also eventually perish, just like dust before the wind.

Traveling to distant foreign dynasties, we see that Zhao Gao of the Qin Dynasty, Wang Mang of the Han Dynasty, Zhu Yi of the Liang Dynasty, and Lu Shan of the Tang Dynasty all did not follow the policies of their former rulers and previous emperors, only pursued pleasure and did not heed advice, did not realize that the world was in turmoil, and did not understand the sorrows of the people. As a result, they did not last long and perished.

【速報】急騰・急落銘柄報告スレ18284 より

788 :山師さん@トレード中 :2025/04/29(火)23:06:19 ID:mf0eOL3f0NIKU

CB Consumer Confidence Report: Average 12-month inflation expectations reached 7% in April—the highest since November 2022, when the US was experiencing extremely high inflation.
CB消費者信頼感レポート:12か月平均のインフレ期待は4月に7%に達し、米国が極めて高いインフレを経験していた2022年11月以来の最高値となった。

値が上がるというより物が消える気がするんだけど(´・ω・`)

【速報】急騰・急落銘柄報告スレ18275 より

795 :山師さん@トレード中 :2025/04/25(金)00:46:55 ID:ctQhwxTA0

JAPAN IS CONSIDERING INCREASE IN IMPORTS OF AMERICAN SOYBEANS TO HELP U.S. OFFSET LOSS OF EXPORTS TO CHINA - NIKKEI
日本、米国産大豆の輸入増を検討 中国への輸出減を補う - 日本経済新聞

納豆増産待ったなし(´・ω・`)

857 :山師さん@トレード中 :2025/04/25(金)05:45:16 JoI5HJ/t0

>>795
あべちゃんのコーンのときとかわってない(´・ω・`)

799 :山師さん@トレード中 :2025/04/25(金)01:03:45 y7LKI0SZ0

>>795
米がないなら納豆を食えばいいじゃない(´・ω・`)ナットウキナーゼトワネット

【速報】急騰・急落銘柄報告スレ18273 より

32 :山師さん@トレード中 :2025/04/23(水)23:20:16 ID:1ZYudzrJ0

White House would look at lowering tariffs on Chinese imports pending talks with China, according to a source.
情報筋によると、ホワイトハウスは中国との協議が終わるまで、中国からの輸入品に対する関税の引き下げを検討するという。

スーパーの棚が空になってヅラ排斥運動起きたら困るしな(´・ω・`)

【速報】急騰・急落銘柄報告スレ18273 より

21 :山師さん@トレード中 :2025/04/23(水)23:15:23 ID:4mDi0Ufk0

*U.S. TREASURY SECRETARY BESSENT SAYS 'AMERICA FIRST DOES NOT MEAN AMERICA ALONE'
による英語からの翻訳
*ベッセント米財務長官は「アメリカ第一主義はアメリカ単独主義を意味しない」と述べた。

どゆこと(^o^)

【急騰】今買えばいい株22213【修正】 より

654 :山師さん:2025/04/22(火)13:52:31 ID:jfHHoR0o

A Japanese bubble may finally be starting, and the reason is that Trump is sloppy!
If American funds come to Japan and a bubble starts, Japan will become the world leader.
Shigeru Ishiba! This is the beginning of a great comeback story!

692 :山師さん:2025/04/22(火)14:00:17 bgfyvJy/

>>654
give me a break

Japanese market is already in the end of the bubble,
think how much bank of Japan bought, they'll sell you as much as you want, am I wrong!!

【急騰】今買えばいい株22208【団鬼六】 より

536 :山師さん:2025/04/21(月)22:53:54 ID:fbXSdLse

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

547 :山師さん:2025/04/21(月)23:01:35 Rfp0DKa2

>>536
荒らすなボケ!

【急騰】今買えばいい株22208【団鬼六】 より

528 :山師さん:2025/04/21(月)22:51:37 ID:HQwTJw7C

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【急騰】今買えばいい株22208【団鬼六】 より

527 :山師さん:2025/04/21(月)22:51:14 ID:N5bUdpKO

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【急騰】今買えばいい株22208【団鬼六】 より

526 :山師さん:2025/04/21(月)22:51:03 ID:+p5wlGn+

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【急騰】今買えばいい株22208【団鬼六】 より

521 :山師さん:2025/04/21(月)22:50:11 ID:rwHZuuRz

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【速報】急騰・急落銘柄報告スレ18261 より

140 :山師さん@トレード中 :2025/04/18(金)08:36:43 ID:tbspoMff0

保安官代理(Deputy Sheriff)
シェリフの部下で郡内で法執行を担当。シェリフが指示する任務を遂行。
ほー(´・ω・`)

161 :山師さん@トレード中 :2025/04/18(金)08:44:34 IQSkPQNyd

>>140
乱暴に食事がしたいなら隣町へ行きな、お前はこの町にいちゃなんねえんだよ
って言っていじめていたのも保安官だったね

【急騰】今買えばいい株22191【Doする?手土産】 より

287 :山師さん:2025/04/16(水)21:48:23 ID:i93nKzV1

【速報】 米国、中国に245%の関税 中国以外の国の高関税は一時停止 ★3
https://asahi.5ch.net/test/read.cgi/newsplus/1744805008/1
1: お断り ★ 2025/04/16(水) 21:03:28.69 ID:8nf12XOb9
Today, President Donald J. Trump signed an Executive Order launching an investigation into the national security risks posed by U.S. reliance on imported processed critical minerals and their derivative products.
本日、トランプ大統領は米国が加工された重要鉱物とその派生製品の輸入に依存していることがもたらす国家安全保障上のリスクについて調査開始する大統領令に署名を行った。

As a result, the individualized higher tariffs are currently paused amid these discussions, except for China, which retaliated.
報復措置を取った中国を除き、個別の高関税の導入は協議が続く中で現在一時停止している。

China now faces up to a 245% tariff on imports to the United States as a result of its retaliatory actions.
中国は報復措置の結果、米国への輸入品に最大245%の関税を課す。

ホワイトハウス公式 (現地時間)2025/4/15 ソース英語『Fact Sheet: President Donald J. Trump Ensures National Security and Economic Resilience Through Section 232 Actions on Processed Critical Minerals and Derivative Products』
https://www.whitehouse.gov/fact-sheets/2025/04/fact-sheet-president-donald-j-trump-ensures-national-security-and-economic-resilience-through-section-232-actions-on-processed-critical-minerals-and-derivative-products/

【急騰】今買えばいい株22189【桜より女の桜色を】 より

522 :山師さん:2025/04/16(水)14:41:41 ID:4L5ch8TD

Many investors will exit the market.
It will be a veritable sea of ​​blood.
Institutional speculation around the world is fleeing the stock market.
The real crash is yet to come!! Run!! The Death Cross has appeared!!

562 :山師さん:2025/04/16(水)14:45:01 +LWR+ZVZ

>>522
ソース何よ

556 :山師さん:2025/04/16(水)14:44:46 kXqyyfIy

>>522
FUCK ME!

554 :山師さん:2025/04/16(水)14:44:36 bR3H0tFE

>>522
オーイエー

545 :山師さん:2025/04/16(水)14:43:22 D9sYNtXS

>>522
早く逃げた方がいいな

540 :山師さん:2025/04/16(水)14:42:52 StXEMvH3

>>522
デスクロスが出たぞ!ニゲロwww

534 :山師さん:2025/04/16(水)14:42:26 ZU2u2Skd

>>522
逃げたほうがいいな

528 :山師さん:2025/04/16(水)14:42:06 T3fIK8+q

>>522
ぎゃーーーーー

【速報】急騰・急落銘柄報告スレ18254 より

784 :山師さん@トレード中 :2025/04/15(火)23:42:12 ID:iFbsMFNl0

EU's Trade Chief Sefcovic left the meeting with little clarity on the US stance,
struggling to determine the American side’s aims, according to people familiar
with the talks. He met for about two hours with US Commerce Secretary
Lutnick and USTR Greer in Washington Monday.

欧州連合(EU)のセフコビ○チ通商部長は、アメリカ側の狙いを見極めるのに苦慮し、
アメリカ側の姿勢をほとんど明確にしないまま会談を終えた。
月曜日にワシントンでルトニック米商務長官、グリア米通商代表部(USTR)と約2時間会談した。

EU破談かもしれないってよ(´・ω・`)

Yahoo掲示板(Y板) - 6083より

941 :その他の関係会社の異…:2025/04/09(水)14:46:00 ID:aon*****

その他の関係会社の異動に関するお知らせ が出ていますね

続きは6083銘柄情報ページでご確認ください

前へ次へ

掲示板書き込み

  • スパム対策の為、URLは"h"を抜いた"ttp"から入力して下さい。
  • 宣伝目的と思われる書き込みに記載されたURLにはサイト内銘柄ページ、ブログランキング他、当サイトからのリンクを全て除外させて頂きます。
お名前: 銘柄コード: 削除キー

規約に同意する。

banner

wait
  • 株式投資 - みんなのお金儲けアンテナ[ブログランキング]
  • 投資ギャンブル ブログサイトランキング
  • 株ライン~ツイッターで株式銘柄探し 株価情報~

恐るべき注目銘柄ランキング

当サイトでアクセスの多い銘柄ランキング(過去3日)

2ch市況1/株式板 話題ランキング

2chの急騰急落銘柄/今買えばいい株スレ等でのレス数ランキング(過去3日)

Yahoo話題銘柄ランキング

Yahoo株式textreamで話題の株式銘柄のトピック数ランキング(過去3日)

市況1板勢いランキング

2ch市況1板内に専用スレのある株式銘柄のランキング。レスの勢いがある銘柄順に並び替えています。
(参考:2ちゃんねる全板・勢いランキング

ランク 銘柄 Pt
1 4565 ネクセラファーマ(株) 13

株式銘柄 関連銘柄別2chレス数ランキング

株式銘柄 関連銘柄別yahooトピ数ランキング

株式銘柄 業種別2chレス数ランキング

株式銘柄 業種別yahooトピ数ランキング

市況1/株式板レス タグクラウド

過去3時間内で市況1/株式板で注目されたワードをタグクラウド化

当サイトが週刊SPA!に掲載されました!

spa

2ちゃん系仕手株情報サイトで儲ける方法 週刊SPA!7/24・31合併号のマネー(得)総本部のコーナーで当サイト『恐るべき注目銘柄株速報』のインタビュー記事が掲載されました。

週刊SPA!7/24・31合併号

blog_parts_sample

※このブログパーツは株ブログパーツページより無料配布中です

新着レス:

hide

top