4319TAC(株)
市場:東証STD
業種:サービス業
Tac Co。、Ltd。主に教育サービスの提供に従事しています。個人教育セグメントは、認定された公会計士、税収、不動産鑑定士、認定社会保険労働コンサルタント、証券アナリスト、情報技術エンジニアなどなど、認定試験の試験準備を提供しています。コーポレートトレーニングセグメントは、企業、大学、職業学校、会計事務所などの認定取得およびその他のトレーニングとコースの提供、学習資料およびコンサルティングサービスの提供、税充填ソフトウェアの販売、パートナースクールおよびその他のビジネスの販売に従事しています。出版セグメントは、教育書のラインナップの公開に従事しています。人事セグメントは、人事の配置と人員配置サービスの提供、およびインターネット上での営業職場の営業サイトに従事しています。
関連: 資格学校/eラーニング/アベノミクス/サマータイム/人材紹介/出版/人生100年時代/あえてスタンダード/サービス業
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2025/05/06 PR TAC(4319)は大丈夫?あの株界レジェンドが今強く警告している大化け銘柄とは…
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2025/05/01 05月01日みやけウォッチ銘柄
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2024/12/06 株で勝つための情報あります!成果を毎日公開、真実の銘柄情報が欲しい方は御覧ください!
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2024/11/28 2024/11/28
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【2ch】市況1板、株式板の反応(新着順)
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【急騰】今買えばいい株22243【セルインメ】 より
694 :山師さん:2025/04/30(水)17:33:24 ID:X82h/ETT.net
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん:2025/04/21(月)22:53:54 ID:fbXSdLse.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん:2025/04/21(月)22:51:37 ID:HQwTJw7C.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん:2025/04/21(月)22:51:14 ID:N5bUdpKO.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん:2025/04/21(月)22:51:03 ID:+p5wlGn+.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん:2025/04/21(月)22:50:11 ID:rwHZuuRz.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
板別にレスを表示する
Yahoo掲示板(Y板)の反応(新着順)
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2025/05/03(土) 17:48:00投稿者:xfi*****
期待するものにとっては、前兆かも知れない♪
これについては詳しくは言いません。自分で調べてくださいごめんなさい。
https://goper.keitombee.work/stocks/index.html
2025/05/03(土) 15:41:00投稿者:xfi*****
掲載されていて参考になりました、ありがとうございます
ちゃんとした根拠が有るんだよ、
https://sande.pywasadefe.site/articles/market/index.html
2025/05/03(土) 08:37:00投稿者:xfi*****
期待するものにとっては、前兆かも知れない♪
https://goper.keitombee.work/press/index.html
これについては詳しくは言いません。自分で調べてくださいごめんなさい。
2025/05/03(土) 00:10:00投稿者:bla*****
期待するものにとっては、前兆かも知れない♪
https://shhol.pywasadefe.net/articles/press/index.html
これについては詳しくは言いません。自分で調べてくださいごめんなさい。
2025/05/02(金) 18:52:00投稿者:13c*****
公認会計士試験、AIが突破したみたいだけど、今後受講者大丈夫か?
2025/05/02(金) 06:20:00投稿者:saw*****
買い増しのチャンスだ!
2025/05/01(木) 22:29:00投稿者:7c5*****
いつものようにブーメランか。
2025/05/01(木) 16:50:00投稿者:iti*****
増配あるかもね。
2025/05/01(木) 16:44:00投稿者:kakkun
ちょうど窓埋めた感じか
2025/05/01(木) 15:07:00投稿者:PPA2
流石に下がりすぎw
買い増します!
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#TAC(4319)から #株主優待 が到着😃
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