5857AREホールディングス(株)[アサヒHD]
市場:東証PRM
業種:非鉄金属業
アーサヒ・ホールディングス・インクであるHoldings Incは、主に貴金属事業と環境保護事業に従事している日本に拠点を置く企業です。同社は2つのビジネスを運営しています。貴金属セグメントは、貴金属を含むスクラップ金属からの金、銀、パラジウム、プラチナなどの貴金属のリサイクルと販売、および主に金と銀の貴金属の精製と処理に従事しています。環境保全セグメントは、主に産業廃棄物の収集、輸送、および中間治療に従事しています。
関連: 貴金属回収/レアメタル/JPX日経400/リサイクル/レアアース/液晶部材・部品/都市鉱山/BRICs/コバルト/ESG投資/銀
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【すぐ実践可能】短期トレードの新常識!チャートのおいしいところだけを見る方法
AREホールディングス(5857)時間別の2ch&Yahoo投稿数推移(48時間)
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2025/05/05 PR 【5857】アサヒHDをまだ握ってる人は手離すべき?!最新技術と方法な知識で次世代型の投資戦略をご提案!
- プレナスでは最新AIを用いることで膨大なデータ量を人間では不可能な速度で分析・判断が可能です。人力をメインとする投資顧問では…
- https://plenus-investment.com/
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2025/01/30 1月30日 (木)
- 4290 PI 500株 (-500円) 5857 AREホールディングス 400株 (-5,200円) 9158 シーユーシー 400株 (-32,400円) 今日の利益 2025.01.28 -38,100円 0勝3敗 今週の利益 2025.01.(27-3...
- https://morning-trader.blogspot.com/2025/01/4290-500-500-5857-400-5200-9158-400.html
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2024/11/24 【5857】AREホールディングス
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2024/11/19 AREホールディングスからの配当金
- AREホールディングス(5857)から配当金計算書が届きました。 配当金40円×100株で4000円 NISA口座で入金額4000円頂きました。 ありがとうございます。
- https://usagikouza.hatenablog.com/entry/2024/11/19/191538
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【2ch】市況1板、株式板の反応(新着順)
スポンサード リンク
【急騰】今買えばいい株22265【勃起】 より
533 :山師さん:2025/05/05(月)20:33:58 ID:A//2mMVZ.net
【速報】急騰・急落銘柄報告スレ18293 より
682 :山師さん@トレード中 :2025/05/02(金)19:41:26 ID:BuQ9hcEB0.net
Japan PM Ishiba: The US auto tariffs are absolutely unacceptable - FNN Interview.
石破首相:米国の自動車関税は絶対に容認できない - FNNインタビュー。
お、珍しくねっとりしてないぞ(´・ω・`)
【速報】急騰・急落銘柄報告スレ18282 より
885 :山師さん@トレード中 :2025/04/28(月)19:51:43 ID:t85KpOfy0.net
FinancialJuice
@financialjuice
Japan Economy Minister Akazawa: We are not thinking about sacrificing agricultural
products for the sake of autos in tariff negotiations
赤沢経財相:関税交渉において、自動車を理由に農産物を犠牲にすることは考えていない
参考
自民・食料安保本部「農水産品を犠牲にするな」決議を採択 森山幹事長「守るべきは守るという姿勢を徹底」
4/25(金)(TBS NEWS DIG Powered by JNN)
アメリカは、そんなに日本に都合良く話を受けてくれるのだろうか? (´・ω・`)
【急騰】今買えばいい株22232【GW雑談】 より
366 :山師さん:2025/04/27(日)21:15:15 ID:c+60HmU9.net
Recommended words to avoid
Captain
Kyoputen
Diarrhea
Tamaoji
Makibao
ZARD Man
Percy
Penirun
Pekora
Osakeski
Wisekey Man
Kirasura
Kirakira
Metaplaman
Spider
Babusura
Small fish
Gargle
Sniffed
Line break
Lost Money George
Other nicknames
Accounts that are deliberately involved with such pointless nicknames that are full of Virtua and Slime
It's a nuisance, so you guys should just start a separate thread and keep it private, most people aren't interested
【急騰】今買えばいい株22230【爆益ディスカ】 より
928 :山師さん:2025/04/26(土)03:03:43 ID:q3InTKVP.net
BREAKING: President Trump says another tariff pause is unlikely after the 90-day pause ends.
We are currently 16 days into the 90-day pause.
速報:トランプ大統領は、90日間の関税停止期間終了後に再度の関税停止が行われる可能性は低いと述べた。
現在、90 日間の休止期間の 16 日目が経過しています。
https://x.com/KobeissiLetter/status/1915828031865659576
【速報】急騰・急落銘柄報告スレ18278 より
443 :山師さん@トレード中 :2025/04/26(土)02:55:18 ID:Ves0WfcS0.net
>>440
FinancialJuice
@financialjuice
Trump: People are beginning to understand how good tariffs are.
トランプ氏:国民は関税がいかに良いものであるかを理解し始めている。
何か、参考になれば・・・(´・ω・`)
【急騰】今買えばいい株22230【爆益ディスカ】 より
121 :山師さん:2025/04/25(金)18:18:02 ID:XRGCxQR+.net
Recommended words to avoid
Captain
Kyoputen
Diarrhea
Tamaoji
Makibao
ZARD Man
Percy
Penirun
Pekora
Osakeski
Wisekey Man
Kirasura
Kirakira
Metaplaman
Spider
Babusura
Small fish
Gargle
Sniffed
Line break
Lost Money George
Other nicknames
Accounts that are deliberately involved with such pointless nicknames that are full of Virtua and Slime
It's a nuisance, so you guys should just start a separate thread and keep it private, most people aren't interested
【急騰】今買えばいい株22224【トランプリン】 より
620 :山師さん:2025/04/24(木)15:09:52 ID:xNrxHHJk.net
BREAKING: Hackers are targeting online trading accounts in Japan to manipulate penny stocks across the world in $700 million illicit trading spree —
による英語からの翻訳
速報:ハッカーが日本のオンライン取引口座を標的に、世界中のペニー株を不正操作し、7億ドル規模の不正取引を実行中
終わりだよ市場
【急騰】今買えばいい株22217【素チン】 より
189 :山師さん:2025/04/23(水)11:43:42 ID:upPe5xhk.net
Recommended words to avoid
Captain
Kyoputen
Diarrhea
Tamaoji
Makibao
ZARD Man
Percy
Penirun
Pekora
Osakeski
Wisekey Man
Kirasura
Kirakira
Metaplaman
Spider
Babusura
Small fish
Gargle
Sniffed
Line break
Lost Money George
Other nicknames
Accounts that are deliberately involved with such pointless nicknames that are full of Virtua and Slime
You're in the way, so just start a separate thread and keep it private, most people aren't interested
【急騰】今買えばいい株22216【寄りチン】 より
797 :山師さん:2025/04/23(水)10:43:39 ID:mbMNQKnn.net
The selling of Japanese stocks will come later
This will be the beginning of the real crash
The positions of global funds are also different than usual
Take care of your life!!!
【急騰】今買えばいい株22213【修正】 より
656 :山師さん:2025/04/22(火)13:53:47 ID:4Dc97YHZ.net
Recommended words to avoid
Captain
Kyoputen
Diarrhea
Tamaoji
Makibao
ZARDman
Percy
Penirun
Pekora
Osakeski
Wisekeyman
Kirasura
Kirakira
Metaplaman
Spider
Babusura
Small fish
Gargle
Sniffed
Line break
Lost Money George
Other nicknames
Accounts that are deliberately involved with such pointless nicknames
It's annoying, so you guys should just start a separate thread and keep it private, most people aren't interested
【速報】急騰・急落銘柄報告スレ18268 より
163 :山師さん@トレード中 :2025/04/22(火)09:29:35 ID:ZG2/K7JR0.net
5857で再度買ったサンリオを5848で再度損切り
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん:2025/04/21(月)22:53:54 ID:fbXSdLse.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん:2025/04/21(月)22:51:37 ID:HQwTJw7C.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん:2025/04/21(月)22:51:14 ID:N5bUdpKO.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん:2025/04/21(月)22:51:03 ID:+p5wlGn+.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん:2025/04/21(月)22:50:11 ID:rwHZuuRz.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22193【赤澤首相】 より
103 :山師さん:2025/04/17(木)09:39:45 ID:p7//q4+0.net
アサカ理研の連れ上げ期待でARE(前・アサヒ)買いました😀
【急騰】今買えばいい株22191【Doする?手土産】 より
287 :山師さん:2025/04/16(水)21:48:23 ID:i93nKzV1.net
【速報】 米国、中国に245%の関税 中国以外の国の高関税は一時停止 ★3
https://asahi.5ch.net/test/read.cgi/newsplus/1744805008/1
1: お断り ★ 2025/04/16(水) 21:03:28.69 ID:8nf12XOb9
Today, President Donald J. Trump signed an Executive Order launching an investigation into the national security risks posed by U.S. reliance on imported processed critical minerals and their derivative products.
本日、トランプ大統領は米国が加工された重要鉱物とその派生製品の輸入に依存していることがもたらす国家安全保障上のリスクについて調査開始する大統領令に署名を行った。
As a result, the individualized higher tariffs are currently paused amid these discussions, except for China, which retaliated.
報復措置を取った中国を除き、個別の高関税の導入は協議が続く中で現在一時停止している。
China now faces up to a 245% tariff on imports to the United States as a result of its retaliatory actions.
中国は報復措置の結果、米国への輸入品に最大245%の関税を課す。
ホワイトハウス公式 (現地時間)2025/4/15 ソース英語『Fact Sheet: President Donald J. Trump Ensures National Security and Economic Resilience Through Section 232 Actions on Processed Critical Minerals and Derivative Products』
https://www.whitehouse.gov/fact-sheets/2025/04/fact-sheet-president-donald-j-trump-ensures-national-security-and-economic-resilience-through-section-232-actions-on-processed-critical-minerals-and-derivative-products/
【急騰】今買えばいい株22189【桜より女の桜色を】 より
522 :山師さん:2025/04/16(水)14:41:41 ID:4L5ch8TD.net
Many investors will exit the market.
It will be a veritable sea of blood.
Institutional speculation around the world is fleeing the stock market.
The real crash is yet to come!! Run!! The Death Cross has appeared!!
【急騰】今買えばいい株22188【妖艶デヴィ夫人】 より
893 :山師さん:2025/04/16(水)13:46:06 ID:1OUEg0O/.net
Institutional investors are increasing their cash ratios; the real crash may be delayed
板別にレスを表示する
Yahoo掲示板(Y板)の反応(新着順)
スポンサード リンク
2025/05/03(土) 03:02:00投稿者:新小岩+55204@151.2
誰だ青く染めたの?機知がい?
2025/05/02(金) 21:08:00投稿者:tom*****
だれも投稿しなくなったね
いつまで調整するんでしょうか
2025/05/01(木) 21:34:00投稿者:ザビエル
★松田産業(7456)
四季報では、
金相場と業績は、相関関係にあると単純明快なんだが、、。
2025/05/01(木) 19:07:00投稿者:主:配当金目的・副:売買益目的
まあ、もっともらしいような言い方しますが、まだまだAIの精度は高くはない…
何かちょっとホッとする自分がいます(笑)
個人的な見解としては、
金価格の上昇=金を買う人が増える(※注1)、金の需要が売買が増える、それがAREの業績上振れに繋がるので、金の価格はそれなりに業績に影響はある、と思っています。
(※注1)買う人が少なくても流通する量が減ることで価格が上がる、という可能性もなきにしもあらず、ですが、金についてはそういうことはないでしょう。
2025/05/01(木) 18:35:00投稿者:主:配当金目的・副:売買益目的
はい、Copilotに追加で聞いてみました。
以下、回答
「AREホールディングスの株価や利益が金価格の上昇ほど伸びていない理由はいくつか考えられます。
- 事業構造の影響
AREホールディングスは貴金属リサイクルや産業廃棄物処理を主な事業としています。そのため、金価格の上昇は収益の一部を押し上げる要因にはなりますが、直接的な影響は限定的です。
- 利益減少の要因
2025年3月期の連結純利益は前期比41.5%減の143.19億円となっています。これは、親会社の所有者に帰属する利益が減少したことが影響しています。また、2024年には産業廃棄物処理事業の統合などの影響で、純利益が46%減少する見通しとなっています。
- 減配の影響
配当金は前期の90円から80円へと減配される予定であり、これが投資家の評価に影響を与えている可能性があります。
- 市場環境と他の貴金属価格の影響
金価格は上昇していますが、ロジウムやパラジウムなどの価格が下落したことが業績に影響を与えています。」
金価格の上昇が企業の業績に直結するわけではなく、事業構造や市場環境、財務戦略などが複雑に絡み合っていることが要因と考えられます。投資を検討する際は、こうした要素を総合的に考慮することが重要ですね。
2025/05/01(木) 14:49:00投稿者:mom*****
最近ずっと引けでほぼ売られて終わっていることに気付けていますか?
2025/05/01(木) 13:52:00投稿者:dat*****
少し枚数へらすわ
2025/05/01(木) 10:29:00投稿者:spf*****
アサヒのままでも良かった
2025/04/30(水) 15:44:00投稿者:新小岩+55204@151.2
エーアールイーホールディングス…おれはそうよんでる、。アレなんていわない
2025/04/30(水) 11:21:00投稿者:7ca*****
理由はともかく
年寄りが元気になることは
良いことだなww
twitter検索
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kenchiko21
ナンピン買いで5857 AREホールディングスで指値入れたけど刺さらず。
他の銘柄は結構下がったのになぁ。
もう少し値を上げて入れ直すかな。 |
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nVEmGnqXie39ill
2023年7月11日(火)
ジャフコグループ (8595) 10
ソニーグループ (6758) 1
全国保証 (7164) 1
AREホールディングス (5857) 2 |
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yosh00141
7/11 今日のS株(前場)
✅買い
9432 NTT ⑳
2784 アルフレッサ ⑥
5857 ARE HD ⑥
9381 AIT ②
9433 KDDI
7203 トヨタ
8309 三井住友トラスト・ホールディングス
ぼちぼちです。 |
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invest_kumakuma
🐻株リサーチ
AREホールディングス(5857)
✅配当利回り:4.69%(90円/1株・予)
✅配当性向:46.4%(直近5期平均)
✅PER/PBR:11.1/1.38
旧アサヒHD(ビールじゃない方)クマ!
貴金属や希少金… https://t.co/wo77xD6sOd |
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tsuchinokonoko5
今日のネオモバ💹
・住友化学(4005):2株
・武田薬品工業(4502):1株
・AREホールディングス(5857):1株
・ニホンフラッシュ(7820):1株
・ベネッセホールディングス(9783):1株
#ネオモバ… https://t.co/mIT97eOmyl |
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nico_R_kabu
今日のネオモバ!
1381 アクシーズ×1
4503 アステラス製薬×1
5187 クリエートメディック×1
5857 AREホールディングス×1
7164 全国保証×1
9432 NTT×10
9856 ケーユーHD×1
ち… https://t.co/v8TXn9lfhe |
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hitom90834
5857 AREホールディングス
岩井コスモ証券が投資判断「バイ」継続で、
目標株価を引き上げ、
買い材料視されている。
https://t.co/0kntx9Y0wM |
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bepoito
持ち株に見慣れない社名🤔❓
アサヒホールディングスが7/1でAREホールディングス(5857)に社名変更していました。アサヒビールと間違えなくなった🙌という声が聞こえますが私は旭硝子【AGC(5201)】と間違えて買ってました。… https://t.co/MVmfeuLrqJ |
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ARE買うか