【4335】アイ・ピー・エス【IPS】
1 : 管理人 : 2012/07/30(月) 20:30:38 ID:OwnerKabu685
アイ・ピー・エス[4335] - 独SAP社のERPパッケージ(統合業務ソフト、経営資源を管理、統合するシステム)「R/3」の導入サービスが中核。導入コンサルティングを行い、R/3の部品を組み合わせるとともに、部品がない業務機能は独自開発を行い、システムとしてパッケージ化。ERP市場は大手企業の導入が一巡、中堅・中小企業向けが中心に。中堅企業向けに求められる、高いコストパフォーマンスを追求。クラウド型サービスにも進出。
会社HP:ttp://www.ips.ne.jp/
[4335]アイ・ピー・エス 2ch&Yahoo板統合 新着口コミ情報
※コメントは常に更新されます
【急騰】今買えばいい株22222【にゃんにゃん】 より
743 :山師さん:2025/04/24(木)10:38:29 ID:tZSUlLq1
Yahoo掲示板(Y板) - 4335より
497 :普段出来高が1万株も…:2025/04/22(火)19:01:00 ID:mas*****
普段出来高が1万株もない閑散株なのになんなんすかね インサイダーはここまで露骨にはやらないし
Yahoo掲示板(Y板) - 4335より
496 :いつものパターンね:2025/04/22(火)11:23:00 ID:wsw*****
いつものパターンね
【急騰】今買えばいい株22210【全無】 より
729 :山師さん:2025/04/22(火)11:22:16 ID:0KhRngjD
IPSオーバーキルおめw
Yahoo掲示板(Y板) - 4335より
495 :今日も、:2025/04/22(火)11:08:00 ID:wsw*****
今日も、やってはる☺️ 高値近辺で売り出しとく✌️
【急騰】今買えばいい株22210【全無】 より
598 :山師さん:2025/04/22(火)11:03:13 ID:v94CVOJk
アイ・ピー・エス
【急騰】今買えばいい株22210【全無】 より
593 :山師さん:2025/04/22(火)11:02:29 ID:0KhRngjD
IPS↑
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん:2025/04/21(月)22:53:54 ID:fbXSdLse
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
547 :山師さん:2025/04/21(月)23:01:35 Rfp0DKa2
>>536
荒らすなボケ!
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん:2025/04/21(月)22:51:37 ID:HQwTJw7C
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん:2025/04/21(月)22:51:14 ID:N5bUdpKO
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん:2025/04/21(月)22:51:03 ID:+p5wlGn+
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん:2025/04/21(月)22:50:11 ID:rwHZuuRz
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22207【殺技団】 より
981 :山師さん:2025/04/21(月)18:01:28 ID:04LyRcZK
ドル円が後60pipsで140割れてしまうやん
【急騰】今買えばいい株22204【日本株暴騰】 より
142 :山師さん:2025/04/21(月)07:01:53 ID:Ad09o5Q+
住友ファーマどうすっかな
iPSはセルシードで製造に難があるってのがわかっているからクオリプスも下がったし創薬系の動きと違うんだよね
【急騰】今買えばいい株22201【ウジクロ】 より
380 :山師さん:2025/04/18(金)17:38:39 ID:JuLY+Rg8
ips系元気やな
【急騰】今買えばいい株22199【週末どこ行こ】 より
70 :山師さん:2025/04/18(金)10:42:12 ID:VA4P111J
iPSとかだいたい新技術とかは10年後に花開くからなAIも話題になって10年だしそういう意味ではジオマテックのHRDPももうすぐ実を結ぶときなんだよね
次世代半導体のデファクトスタンダードになれれば莫大な利益が今後しばらくもたらされる事になる
【急騰】今買えばいい株22197【コロコロ恫喝】 より
841 :山師さん:2025/04/18(金)08:17:26 ID:sx6I82Ml
iPSといえばクオリプスの値動き怖えよ
【急騰】今買えばいい株22197【コロコロ恫喝】 より
832 :山師さん:2025/04/18(金)08:10:23 ID:qQl1iSUZ
IPS関連と言えば4390来るか?
【急騰】今買えばいい株22197【コロコロ恫喝】 より
829 :山師さん:2025/04/18(金)08:09:35 ID:6d1oGGQA
IPS関連が動いているから調整十分なクオリプスいいな
7000円を底にしてるから低リスクだし惚れてしまう
Yahoo掲示板(Y板) - 4335より
494 :もうちょい取れたけど…:2025/04/17(木)17:54:00 ID:toj
もうちょい取れたけど、抜けれたからいいや
Yahoo掲示板(Y板) - 4335より
493 :打ち上げ花火のような…:2025/04/17(木)14:50:00 ID:Mar
打ち上げ花火のような値動きだったね。 自分はまだまだ塩漬け。
Yahoo掲示板(Y板) - 4335より
492 :ま~た荒らしか。:2025/04/17(木)14:47:00 ID:猫ちゃうまん。(TecHunt)
ま~た荒らしか。 最近毎日グロース同じ動きする銘柄多数
Yahoo掲示板(Y板) - 4335より
491 :あーあw:2025/04/17(木)14:22:00 ID:ごろう
あーあw
Yahoo掲示板(Y板) - 4335より
490 :どうしたの?:2025/04/17(木)14:16:00 ID:どんどこどん
どうしたの?
Yahoo掲示板(Y板) - 4335より
489 :しまった!!見逃した…:2025/04/17(木)14:13:00 ID:wsw*****
しまった!!見逃した(´;ω;`)
【急騰】今買えばいい株22195【金持ち喧嘩せず】 より
437 :山師さん:2025/04/17(木)14:09:14 ID:2rtRM6qX
アイピーエスにぶんなげきたー
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