【3916】デジタル・インフォメーション・テクノロジー【DIT】
1 : 管理人 : 2015/05/19(火) 03:11:08 ID:OwnerKabu685
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デジタル・インフォメーション・テクノロジーの銘柄情報はコチラ→3916
[3916]デジタル・インフォメーション・テクノロジー 2ch&Yahoo板統合 新着口コミ情報
※コメントは常に更新されます
Yahoo掲示板(Y板) - 3916より
667 :昨今の証券会社の乗っ…:2025/05/05(月)16:50:00 ID:rur*****
Yahoo掲示板(Y板) - 3916より
666 :【最高益更新】前期買…:2025/05/01(木)09:43:00 ID:to*****
【最高益更新】前期買収2社通期寄与。業務システム開発・運用は金融系案件が想定超で増える。組み込み開発・検証も車載関連が伸長。情報セキュリティ商材中心に自社開発品の増販続く。最高純益更新。26年6月期は金融系を柱に豊富な受注残消化。 四季報より
【速報】急騰・急落銘柄報告スレ18287 より
232 :山師さん@トレード中 :2025/04/30(水)17:58:32 ID:LZaG69/30
Pres Xi: China Needs To Adapt To Changing Situations - Xinhua
- China To Adjust Economic Plan Based On Global Change
- To Promote Transformation Of Traditional Industries
- Urges Measures To Stabilize Employment
- Stabilize Markets And Expectations
習主席:中国は状況の変化に適応する必要がある-新華社
-中国、世界の変化に基づき経済計画を調整へ
-伝統産業の転換を推進へ
-雇用安定に向けた措置を促す
-市場と期待の安定化
普通やないかい(´・ω・`)
Yahoo掲示板(Y板) - 3916より
665 :出遅れた方は今日はチ…:2025/04/22(火)07:12:00 ID:かず
出遅れた方は今日はチャンスでしょう。 売り方も買い戻しを進めないと、やがて訪れる壮大な踏み上げ相場に巻き込まれてしまいますよ。 年初来高値2626円などやがて普通に更新するでしょう。 そういうもんだからです。
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん:2025/04/21(月)22:53:54 ID:fbXSdLse
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
547 :山師さん:2025/04/21(月)23:01:35 Rfp0DKa2
>>536
荒らすなボケ!
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん:2025/04/21(月)22:51:37 ID:HQwTJw7C
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん:2025/04/21(月)22:51:14 ID:N5bUdpKO
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん:2025/04/21(月)22:51:03 ID:+p5wlGn+
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん:2025/04/21(月)22:50:11 ID:rwHZuuRz
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22203【週末ディスカ】 より
245 :山師さん:2025/04/20(日)11:46:30 ID:9aSLCDZA
どのゲーム買うか迷う
アトムフォール
Obscur: Expedition 33
インディ・ジョーンズ
251 :山師さん:2025/04/20(日)11:50:42 Yz2Lovf2
>>245
AtomFallはストーリーよくわからんかった
247 :山師さん:2025/04/20(日)11:48:08 eGrUGyhK
>>245
COE33一択だろ
Yahoo掲示板(Y板) - 3916より
664 :1900円で張ってい…:2025/04/17(木)22:00:00 ID:fuj*****
1900円で張っていた
【急騰】今買えばいい株22183【日経平穏】 より
919 :山師さん:2025/04/15(火)20:45:08 ID:3t7akxB2
provoca l'infezione della membrana cardiaca e degli stessi tessuti del cuore detta miocardite?
【速報】急騰・急落銘柄報告スレ18246 より
559 :山師さん@トレード中 :2025/04/12(土)23:57:48 ID:JpWlWniX0
Warning lights flash for US consumer strength as credit defaults rise (THE FINANCIAL TIMES)
クレジット・デフォルトの増加で米消費者の強さに警告灯が点滅
ヒタヒタと、目立たずに近づいて来るものが・・・(´・ω・`)
Yahoo掲示板(Y板) - 3916より
663 :関税で下がったので …:2025/04/11(金)20:53:00 ID:pla*****
関税で下がったので 期待込めて購入 やっと 上がってくれた!
Yahoo掲示板(Y板) - 3916より
662 :インターネットセキュ…:2025/04/03(木)07:53:00 ID:rur*****
インターネットセキュリティの需要がますます高まっている。 四季報見てみると、この会社には未来しかない。
Yahoo掲示板(Y板) - 3916より
661 :今日は絶好の買い場に…:2025/04/03(木)07:18:00 ID:かず
今日は絶好の買い場になるでしょう。 年初来高値2626円などハードルは低く、やがて普通に更新するだろう。
Yahoo掲示板(Y板) - 3916より
660 :さすがにこの相場でこ…:2025/04/02(水)20:35:00 ID:fuj*****
さすがにこの相場でこれは不自然ではないか。どこか大口が集めているのか。
Yahoo掲示板(Y板) - 3916より
659 :ぐううかぶたんめ。:2025/03/27(木)21:12:00 ID:fuj*****
ぐううかぶたんめ。とりあえず2000でいいから戻しなさい。
Yahoo掲示板(Y板) - 3916より
658 :四季報見て買ってるな…:2025/03/19(水)10:11:00 ID:gyv*****
四季報見て買ってるなぁ
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昨今の証券会社の乗っ取りは、ココにとって追い風で良い?