exiv

【恐るべき株】今急騰/急落している株、仕手株、低位株、思惑株、材料株など、今みんなが注目している銘柄をほぼリアルタイムでランキング化!個別株銘柄情報も口コミや掲示板など中心にまとめています。
【2ch】急騰株 急落株 仕手株 注目銘柄【Yahoo】ファイナンス掲示板(Y板)よりそれぞれの注目銘柄ランキングが表示され、 レス数ボタン・トピ数ボタンをクリックする事で最新銘柄口コミ情報が表示されます!気になる株式銘柄がある方は是非お試しください。 仕手・仕手株・仕手筋とは?

[お知らせ]
リアルタイム注目キーワードランキング をホームに設置しました。2ch市況1/株式板で今リアルタイムで話題の注目キーワードをご覧ください。 ※現在1位のキーワードは『明日』です
本日、仕手株として話題になっている銘柄は 仕手・仕手株 こちらの検索結果をご参考に。

【3916】デジタル・インフォメーション・テクノロジー【DIT】

1 : 管理人 : 2015/05/19(火) 03:11:08 ID:OwnerKabu685

[特色]-
[連結事業]-

前へ次へ

現在書き込みはありません。
デジタル・インフォメーション・テクノロジーを保有している方や思惑のある方は、ぜひ書き込みして行ってください!

デジタル・インフォメーション・テクノロジーの銘柄情報はコチラ→3916

[3916]デジタル・インフォメーション・テクノロジー 2ch&Yahoo板統合 新着口コミ情報

※コメントは常に更新されます

Yahoo掲示板(Y板) - 3916より

667 :昨今の証券会社の乗っ…:2025/05/05(月)16:50:00 ID:rur*****

昨今の証券会社の乗っ取りは、ココにとって追い風で良い?

Yahoo掲示板(Y板) - 3916より

666 :【最高益更新】前期買…:2025/05/01(木)09:43:00 ID:to*****

【最高益更新】前期買収2社通期寄与。業務システム開発・運用は金融系案件が想定超で増える。組み込み開発・検証も車載関連が伸長。情報セキュリティ商材中心に自社開発品の増販続く。最高純益更新。26年6月期は金融系を柱に豊富な受注残消化。               四季報より

【速報】急騰・急落銘柄報告スレ18287 より

232 :山師さん@トレード中 :2025/04/30(水)17:58:32 ID:LZaG69/30

Pres Xi: China Needs To Adapt To Changing Situations - Xinhua
- China To Adjust Economic Plan Based On Global Change
- To Promote Transformation Of Traditional Industries
- Urges Measures To Stabilize Employment
- Stabilize Markets And Expectations
習主席:中国は状況の変化に適応する必要がある-新華社
-中国、世界の変化に基づき経済計画を調整へ
-伝統産業の転換を推進へ
-雇用安定に向けた措置を促す
-市場と期待の安定化

普通やないかい(´・ω・`)

Yahoo掲示板(Y板) - 3916より

665 :出遅れた方は今日はチ…:2025/04/22(火)07:12:00 ID:かず

出遅れた方は今日はチャンスでしょう。 売り方も買い戻しを進めないと、やがて訪れる壮大な踏み上げ相場に巻き込まれてしまいますよ。 年初来高値2626円などやがて普通に更新するでしょう。 そういうもんだからです。

【急騰】今買えばいい株22208【団鬼六】 より

536 :山師さん:2025/04/21(月)22:53:54 ID:fbXSdLse

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

547 :山師さん:2025/04/21(月)23:01:35 Rfp0DKa2

>>536
荒らすなボケ!

【急騰】今買えばいい株22208【団鬼六】 より

528 :山師さん:2025/04/21(月)22:51:37 ID:HQwTJw7C

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【急騰】今買えばいい株22208【団鬼六】 より

527 :山師さん:2025/04/21(月)22:51:14 ID:N5bUdpKO

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【急騰】今買えばいい株22208【団鬼六】 より

526 :山師さん:2025/04/21(月)22:51:03 ID:+p5wlGn+

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【急騰】今買えばいい株22208【団鬼六】 より

521 :山師さん:2025/04/21(月)22:50:11 ID:rwHZuuRz

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【急騰】今買えばいい株22203【週末ディスカ】 より

245 :山師さん:2025/04/20(日)11:46:30 ID:9aSLCDZA

どのゲーム買うか迷う
アトムフォール
Obscur: Expedition 33
インディ・ジョーンズ

251 :山師さん:2025/04/20(日)11:50:42 Yz2Lovf2

>>245
AtomFallはストーリーよくわからんかった

247 :山師さん:2025/04/20(日)11:48:08 eGrUGyhK

>>245
COE33一択だろ

Yahoo掲示板(Y板) - 3916より

664 :1900円で張ってい…:2025/04/17(木)22:00:00 ID:fuj*****

1900円で張っていた

【急騰】今買えばいい株22183【日経平穏】 より

919 :山師さん:2025/04/15(火)20:45:08 ID:3t7akxB2

provoca l'infezione della membrana cardiaca e degli stessi tessuti del cuore detta miocardite?

【速報】急騰・急落銘柄報告スレ18246 より

559 :山師さん@トレード中 :2025/04/12(土)23:57:48 ID:JpWlWniX0

Warning lights flash for US consumer strength as credit defaults rise (THE FINANCIAL TIMES)
クレジット・デフォルトの増加で米消費者の強さに警告灯が点滅

ヒタヒタと、目立たずに近づいて来るものが・・・(´・ω・`)

Yahoo掲示板(Y板) - 3916より

663 :関税で下がったので …:2025/04/11(金)20:53:00 ID:pla*****

関税で下がったので 期待込めて購入 やっと 上がってくれた!

Yahoo掲示板(Y板) - 3916より

662 :インターネットセキュ…:2025/04/03(木)07:53:00 ID:rur*****

インターネットセキュリティの需要がますます高まっている。 四季報見てみると、この会社には未来しかない。

Yahoo掲示板(Y板) - 3916より

661 :今日は絶好の買い場に…:2025/04/03(木)07:18:00 ID:かず

今日は絶好の買い場になるでしょう。 年初来高値2626円などハードルは低く、やがて普通に更新するだろう。

Yahoo掲示板(Y板) - 3916より

660 :さすがにこの相場でこ…:2025/04/02(水)20:35:00 ID:fuj*****

さすがにこの相場でこれは不自然ではないか。どこか大口が集めているのか。

Yahoo掲示板(Y板) - 3916より

659 :ぐううかぶたんめ。:2025/03/27(木)21:12:00 ID:fuj*****

ぐううかぶたんめ。とりあえず2000でいいから戻しなさい。

Yahoo掲示板(Y板) - 3916より

658 :四季報見て買ってるな…:2025/03/19(水)10:11:00 ID:gyv*****

四季報見て買ってるなぁ

続きは3916銘柄情報ページでご確認ください

前へ次へ

掲示板書き込み

  • スパム対策の為、URLは"h"を抜いた"ttp"から入力して下さい。
  • 宣伝目的と思われる書き込みに記載されたURLにはサイト内銘柄ページ、ブログランキング他、当サイトからのリンクを全て除外させて頂きます。
お名前: 銘柄コード: 削除キー

規約に同意する。

banner

wait
  • 株式投資 - みんなのお金儲けアンテナ[ブログランキング]
  • 投資ギャンブル ブログサイトランキング
  • 株ライン~ツイッターで株式銘柄探し 株価情報~

市況1板勢いランキング

2ch市況1板内に専用スレのある株式銘柄のランキング。レスの勢いがある銘柄順に並び替えています。
(参考:2ちゃんねる全板・勢いランキング

ランク 銘柄 Pt
1 4565 ネクセラファーマ(株) 13

株式銘柄 関連銘柄別2chレス数ランキング

株式銘柄 関連銘柄別yahooトピ数ランキング

株式銘柄 業種別2chレス数ランキング

株式銘柄 業種別yahooトピ数ランキング

当サイトが週刊SPA!に掲載されました!

spa

2ちゃん系仕手株情報サイトで儲ける方法 週刊SPA!7/24・31合併号のマネー(得)総本部のコーナーで当サイト『恐るべき注目銘柄株速報』のインタビュー記事が掲載されました。

週刊SPA!7/24・31合併号

blog_parts_sample

※このブログパーツは株ブログパーツページより無料配布中です

新着レス:

hide

top