4477ＢＡＳＥ(株)
市場：東証GRT
業種：情報通信業
Base、Inc。 eコマースプラットフォーム、オンライン支払いサービス、融資サービスの提供に従事する日本に拠点を置く会社です。同社は2つのビジネスセグメントを通じて運営されています。ベースセグメントは、オンラインショップ作成サービスと、顧客がそこに設立されたショップから製品を購入できるショッピングモールアプリを提供する電子商取引プラットフォームの提供に従事しています。 Payセグメントは、Pay.jpの開発に従事しています。これにより、Webサービスや既存のオンラインショップにオンライン支払いを簡単に導入できるようになり、独自のID支払いサービスを提供するPay IDが参加できます。
関連： キャッシュレス決済/2019年のIPO/eコマース/業務支援/IT/Webサイト構築/ライブコマース
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- 【2ch】市況１/株式板（5ch）
- 【Yahoo】ファイナンス掲示板
- twitter呟き
- ［4477］ＢＡＳＥ 株式掲示板
関連ブログ情報 新着リスト
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2025/05/06 PR
ＢＡＳＥ(4477)を今から買って大丈夫か？不安要素はいくつかあります…。
- 株式投資の世界で勝ち続けるためには、「銘柄の選定」と「銘柄の売買タイミング」が大事です。適当な銘柄選定では勝てませんし、売買タイミングを誤ってしまうと…
- https://exiv.ne.jp/
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2025/05/05
株主総会（証券コード4477 BASE）
- BASE株式会社 2025年3月27日（木） バーチャルオンリー株主総会
- https://o9056.hatenablog.com/entry/2025/05/05/084800
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2025/03/12
材料はコレ！ BASE(4477)の株価急上昇には理由がある！ - 2025/03/12
- なぜ、最近BASE(4477)の株価は急騰しているのでしょうか？その理由を徹底検証！ここまで株価が上がった経緯を、日足チャートと、ニュース、ブログ、掲示板での反応と共に振り返ります。2025/03/03(月曜日)前日比：+0.5%2025/03/04(火曜日)前日比：-3.4%2025/03/05(水曜日
- https://rizumunet.blog.jp/archives/1084342892.html
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2025/03/11
3月12日の銘柄予想
- 4894 クオリプス4477 BASE7974 任天堂 2586 フルッタフルッタ5243 note
- https://neaga.blog.jp/archives/90111425.html
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【2ch】市況1板、株式板の反応（新着順）
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【急騰】今買えばいい株22262【雇用統計】 より
563 :山師さん：2025/05/03(土)10:30:51 ID:MOvbZsUY.net
【急騰】今買えばいい株22262【雇用統計】 より
559 :山師さん：2025/05/03(土)10:23:25 ID:9I/T7F1l.net
グロースの時代くる？
2016年辺りのゲーセク、コロナ後のBASE諸々の活況な相場でデイトレやってみたい
クソ簡単だったんやろ？
【速報】急騰・急落銘柄報告スレ18291 より
417 :山師さん＠トレード中 ：2025/05/02(金)09:17:26 ID:mNwyTgkl0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
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36760円36760円36760円36760円36760円
36760円36760円36760円36760円36760円
36760円36760円36760円36760円36760円
36760円36760円36760円36760円36760円
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36760円36760円36760円36760円36760円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18287 より
232 :山師さん＠トレード中 ：2025/04/30(水)17:58:32 ID:LZaG69/30.net
Pres Xi: China Needs To Adapt To Changing Situations - Xinhua
- China To Adjust Economic Plan Based On Global Change
- To Promote Transformation Of Traditional Industries
- Urges Measures To Stabilize Employment
- Stabilize Markets And Expectations
習主席：中国は状況の変化に適応する必要がある-新華社
-中国、世界の変化に基づき経済計画を調整へ
-伝統産業の転換を推進へ
-雇用安定に向けた措置を促す
-市場と期待の安定化
普通やないかい(´・ω・｀)
【速報】急騰・急落銘柄報告スレ18285 より
202 :山師さん＠トレード中 ：2025/04/30(水)09:10:41 ID:a0a1ZT9j0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
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35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
35940円35940円35940円35940円35940円
★決済の日時とPRICEは非公表です
【急騰】今買えばいい株22238【祐一大まくり】 より
868 :山師さん：2025/04/30(水)07:41:45 ID:ZP7T0rE7.net
今日はベースフードTOBした人がなぜか買ったbaseの株主総会だとか
買い集めた目的わからなくて返答もないから今日の結果如何ではポイズンピルやるらしくて荒れる可能性あるみたい
【速報】急騰・急落銘柄報告スレ18282 より
205 :山師さん＠トレード中 ：2025/04/28(月)14:17:55 ID:dpg8KI2y0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
35850円35850円35850円35850円35850円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18277 より
41 :山師さん＠トレード中 ：2025/04/25(金)13:08:41 ID:kXMf2KJz0.net
BASE急に上げてる、なんかやってる？(´・ω・｀)
【速報】急騰・急落銘柄報告スレ18274 より
354 :山師さん＠トレード中 ：2025/04/24(木)12:47:22 ID:IkTancqJ0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
35190円35190円35190円35190円35190円
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35190円35190円35190円35190円35190円
35190円35190円35190円35190円35190円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18268 より
263 :山師さん＠トレード中 ：2025/04/22(火)09:48:08 ID:Rr435rSC0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
34140円34140円34140円34140円34140円
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34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
34140円34140円34140円34140円34140円
★決済の日時とPRICEは非公表です
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん：2025/04/21(月)22:53:54 ID:fbXSdLse.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん：2025/04/21(月)22:51:37 ID:HQwTJw7C.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん：2025/04/21(月)22:51:14 ID:N5bUdpKO.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん：2025/04/21(月)22:51:03 ID:+p5wlGn+.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん：2025/04/21(月)22:50:11 ID:rwHZuuRz.net
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【速報】急騰・急落銘柄報告スレ18265 より
157 :山師さん＠トレード中 ：2025/04/21(月)09:15:52 ID:Yh09BF960.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
34550円34550円3455034550円34550円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18261 より
355 :山師さん＠トレード中 ：2025/04/18(金)09:25:39 ID:348JL1m30.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
34370円34370円34370円34370円34370円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18260 より
295 :山師さん＠トレード中 ：2025/04/17(木)17:21:27 ID:BgqoqIs60.net
FinancialJuice
@financialjuice
China March survey-based jobless rate for 16-24 years old, excluding college students
at 16.5% vs 16.9% in previous month - Stats Bureau.
中国3月の調査に基づく16～24歳の失業率（大学生を除く）は16.5％で、
前月の16.9％から低下した - 国家統計局。
低下したとしても、公表数字でこの数字だと、日本の就職氷河期の頃より悪いのね (´・ω・`)
【速報】急騰・急落銘柄報告スレ18258 より
604 :山師さん＠トレード中 ：2025/04/17(木)09:26:42 ID:h0a5V7JC0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
34000円34000円34000円34000円34000円
34000円34000円34000円34000円34000円
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34000円34000円34000円34000円34000円
34000円34000円34000円34000円34000円
34000円34000円34000円34000円34000円
34000円34000円34000円34000円34000円
34000円34000円34000円34000円34000円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18256 より
374 :山師さん＠トレード中 ：2025/04/16(水)13:31:10 ID:tzk3GXvL0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
33980円33980円33980円33980円33980円
33980円33980円33980円33980円33980円
33980円33980円33980円33980円33980円
33980円33980円33980円33980円33980円
33980円33980円33980円33980円33980円
33980円33980円33980円33980円33980円
33980円33980円33980円33980円33980円
33980円33980円33980円33980円33980円
33980円33980円33980円33980円33980円
★決済の日時とPRICEは非公表です
【急騰】今買えばいい株22185【半導体危機】 より
281 :山師さん：2025/04/16(水)09:11:12 ID:kN9ccZ01.net
カバーとか注目されている今だけだもんな
baseとかuuumとかaiinsideみたいになるよ
【速報】急騰・急落銘柄報告スレ18250 より
760 :山師さん＠トレード中：2025/04/14(月)17:06:36 ID:s23X1xhf0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
34180円34180円34180円34180円34180円
34180円34180円34180円34180円34180円
34180円34180円34180円34180円34180円
34180円34180円34180円34180円34180円
34180円34180円34180円34180円34180円
34180円34180円34180円34180円34180円
34180円34180円34180円34180円34180円
34180円34180円34180円34180円34180円
34180円34180円34180円34180円34180円
★決済の日時とPRICEは非公表です
【速報】急騰・急落銘柄報告スレ18243 より
167 :山師さん＠トレード中 ：2025/04/11(金)13:07:07 ID:aA89naao0.net
君たちのBASEが上げ上げで４００円うかがってるな
【速報】急騰・急落銘柄報告スレ18241 より
676 :山師さん＠トレード中：2025/04/11(金)09:12:35 ID:XdWpF6Mu0.net
Nikkei 225 Index YEN-Based Futures：BUY
6月限
32710円32710円32710円32710円32710円
32710円32710円32710円32710円32710円
32710円32710円32710円32710円32710円
32710円32710円32710円32710円32710円
32710円32710円32710円32710円32710円
32710円32710円32710円32710円32710円
32710円32710円32710円32710円32710円
32710円32710円32710円32710円32710円
32710円32710円32710円32710円32710円
★決済の日時とPRICEは非公表です
板別にレスを表示する
Yahoo掲示板（Y板）の反応（新着順）
スポンサード リンク
2025/05/06(火) 20:38:00投稿者:hiro
チャート判断ですが この上昇は個人投資家を騙し買いを誘う 修正波ABCの騙し上げのB波だと考えます！ 上昇の１サイクルが終了後 機関 大口さんがよくやる 買いを誘いその後大きく落とす常套手段だと思います 注意してください！
2025/05/06(火) 20:05:00投稿者:hrr*****
悪いのはないでしょう。
それよりも買収話しとかをちゃんとして欲しいですよね
ここまでなんにもないのはさすがに不安にさせすぎなので
2025/05/06(火) 20:04:00投稿者:ピン
どこかのコメントであったかもしれませんが、
決算発表は何時ごろですか？
2025/05/06(火) 18:47:00投稿者:どうらくもん
決算後とりあえず600円超え期待！”
2025/05/06(火) 17:07:00投稿者:ちひろさん
決算は良いと思う
2025/05/06(火) 09:51:00投稿者:アプリコット
決算で、配当ニュース出して下さい
2025/05/06(火) 09:36:00投稿者:自由人
その前に8日の決算発表内容で今後の動きも予測しやすいような？
2025/05/06(火) 08:03:00投稿者:mah*****
9日の市場で運命決まるんよね
2025/05/05(月) 22:41:00投稿者:自由人
本当に閑散掲示板も続き連休明けて決算発表話から賑やかになりそうだね。
でも株価が上がるかは、分からないと思うよ。
2025/05/05(月) 21:58:00投稿者:mah*****
今日の投稿 たった2件 寂しすぎやろー
twitter検索
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ci_tokyo_bot
グロース市場
出来高前日からの推移 50位以内 出来高アップ
3133：(株)海帆
4570：(株)免疫生物研究所
5253：カバー(株)
4572：カルナバイオサイエンス(株)
4477：ＢＡＳＥ(株)
4395：(株)アクリー… https://t.co/1WypJq12F0 |
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kabudev_dc
2023年07月11日 (火) 日足 75日↓200日移動平均線
5074 テスHD
6908 イリソ電子工業
5941 中西製作所
4477 BASE |
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M_ayaka201218
base 4477とメルカリ、今までは差別化という単語で繕ってきたけど明確な差がでてきたな |
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karauriNET
GOLDMAN SACHSの空売り残高(7/6)
4393 バンク・オブ・イノベーション +0.03%
4477 BASE +0.04%
4485 JTOWER -0.03%
4572 カルナバイオサイエンス -0.26%
45… https://t.co/u0VzREvNnx |
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9swtGeYvBq28289
ぬう！
4477 BASEはなかなか下がらんのう、何かサプライズはないのかのぅ https://t.co/RxpCSFxKlK |
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1108yosi
@naokJ2DyHbITXTg 4477 BASEです。 |
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nanatering
4477 ＢＡＳＥ
岩井コスモ証券が投資判断「バイ」継続で、
目標株価を引き上げ、
買い材料視されている。
https://t.co/ffqu1DCvuw |
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週刊SPA！7／24・31合併号のマネー(得)総本部のコーナーで当サイト『恐るべき注目銘柄株速報』のインタビュー記事が掲載されました。
>>559
コロナ当時は株始めたてでBASEとかマクアケとか値嵩だらけだからビビってたけど今思うと出来高とんでもなくていくらでも上がるガチのチンパン相場だったね
もちろんふるい落としみたいな下落はあるんだけどそれ多少食らっても構わずインしてりゃ余裕でプラスに出来る感じ
今で言うと動きを素直にしたzenmuみたいなのが何銘柄もあった