日本人の金がどんどん詐欺師のいる国に奪われていく

https://pbs.twimg.com/media/GoxlfwHbUAA4izD.png

9433KDDI↑9432みかか↑9434子ハゲバンク↑
4755楽天↓

エバラ終わったｗｗｗｗｗｗｗｗｗｗｗｗｗｗｗｗｗｗ
米国、中国製ソーラーパネルに最高3500％の関税　別の国経由での輸出にも対策
https://jp.reuters.com/markets/commodities/AWJGINI3RRO5FP3SIYB5VO4EA4-2025-04-22/

Recommended words to avoid
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Other nicknames
Accounts that are deliberately involved with such pointless nicknames
It's annoying, so you guys should just start a separate thread and keep it private, most people aren't interested

豊和工業（6203）買ｰいｰ(^o^)／

NVIDIAジェンスン・フアンCEOが石破総理を表敬--「スーツ着用」と話題に　岸田前総理の時は？（CNET Japan）

今回は、「本気」って事だったのだろうか・・・(´・ω・`)

【速報】ＩＩＪ、３１万件漏えい確認
https://pbs.twimg.com/media/GpHLL4DaoAAMm91?format=png&name=medium
(´・ω・`)おもらしはあかんでー

SBIの偽メール
https://pbs.twimg.com/media/Go4Tco1bYAA_BwJ.jpg

全裸の男が学習塾の敷地に無断で侵入したとして現行犯逮捕　直前にタクシーが奪われる事件や死亡ひき逃げ事件も 「それを言ったらまずい」容疑を否認
https://newsdig.tbs.co.jp/articles/-/1869394?display=1

うおおおおお(´・ω・｀)

豊和工業（6203）買ｰいｰ(^o^)／

>>20
JDI先生は大丈夫そうで良かった

>>813
https://pbs.twimg.com/media/GEgVUhaa0AAqn69.jpg
社長見たら買いだはｗ

前から気になってたけど、DIYってダイって読むんじゃないの？

フライトは業績織り込み済みだな

「myVerifist」
携帯キャリアや金融機関などマイナンバー等による対面での本人確認が必須となる法人から引合いを頂いており、既に受注済みの数万台の大口案件（当期中に稼働開始予定）もあり、導入に向けた提案活動を積極化し、本人確認ニーズがある市場を開拓してまいります。
ttps://kabutan.jp/disclosures/pdf/20250214/140120250124555040/

こりゃお仕置きされそうだな

2025-04-22 NVIDIAのCEOがまた北京を訪問！NVIDIAの業績・株価と中国の関係は？
https://www.youtube.com/watch?v=_h6k-nDCv-U

33800円～34200円
https://pbs.twimg.com/media/GpFvEqPbkAAPypk.jpg

高速道路で女子大生3人即死～シャオミ製EVが中国スマートカー業界へ与えた大打撃
https://diamond.jp/articles/-/363423

豊和工業（6203）買ｰいｰ(^o^)／

連休短い？(´･ω･`)
https://pbs.twimg.com/media/Go7wOnja8AA7fw9.jpg

トースター(´･ω･`)
https://pbs.twimg.com/media/GpCTi24bIAA1CP_.jpg
https://pbs.twimg.com/media/GpCTi22aIAAWm_E.jpg

丸亀の新作(´･ω･`)
https://pbs.twimg.com/media/GpDOG5taAAAOs34.jpg

桐谷さん八段昇段で記念撮影(´･ω･`)
https://pbs.twimg.com/media/GpCC3tQacAAZfBP.jpg

【速報】トランプ氏、利下げを再要求
https://pbs.twimg.com/media/GpENOfmawAADQe2?format=png&name=900x900
(´・ω・`)

NVIDIA100もたんか(´・ω・｀)

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.