豊和工業（6203）買ｰいｰ(^o^)／

>>466
BYDが買収して、販売インフラ網を丸ごとゲッツならwinwin
国士様がブチギレ

豊和工業（6203）買ｰいｰ(^o^)／

豊和工業（6203）買ｰいｰ(^o^)／

>>131
でも江頭はユーチューブで謝罪動画出してかなり儲かったんじゃないか
winwinだったのにな(´・ω・｀)

マルウェアってWindows Defenderで防げるの？

そうすると抜け穴ありまくりの糞セキュリティが改善されるだろう
対策しないやつは自己責任で
双方winwinだな

豊和工業（6203）買ｰいｰ(^o^)／

豊和工業（6203）買ｰいｰ(^o^)／

セキュリティソフトって勝手に情報収集して売りさばいたり勝手にマイニングしたりソフトの会社自体がウィルス感染しちゃったり怪しい会社に買収されて知らない間にマルウェアになってたりロクでもない事が少なからずあるからなあ
怪しいサイト見ないならWindows標準のでいいって感じではある

豊和工業（6203）買ｰいｰ(^o^)／

そういやwin11ってポート期間はいつまでなの
12出ないままなら終了期限は設定されないの？

豊和工業（6203）買ｰいｰ(^o^)／

豊和工業（6203）買ｰいｰ(^o^)／

>>23
まずWindowsPC使ってる時点でどこが慎重なんだよｗｗｗ
スマホ一本の方が安全だわな

豊和工業（6203）買ｰいｰ(^o^)／

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Trump: There can be a SLOWING of the economy unless Mr. Too Late, a major loser, lowers interest rates, NOW.
トランプ遅すぎた大負け組が今すぐ金利を下げない限り、経済は減速する可能性がある。

こいつに恨まれたら一生続くみたいだ(´・ω・｀)

メーカーだと機械のSOLIDWORKS、電気のOrCADがwindows専用だからどこもwindowsやね(´・ω・｀)
他の業種はmacのとこも多いんかな

豊和工業（6203）買ｰいｰ(^o^)／