plenus

【恐るべき株】今急騰/急落している株、仕手株、低位株、思惑株、材料株など、今みんなが注目している銘柄をほぼリアルタイムでランキング化!個別株銘柄情報も口コミや掲示板など中心にまとめています。
【2ch】急騰株 急落株 仕手株 注目銘柄【Yahoo】ファイナンス掲示板(Y板)よりそれぞれの注目銘柄ランキングが表示され、 レス数ボタン・トピ数ボタンをクリックする事で最新銘柄口コミ情報が表示されます!気になる株式銘柄がある方は是非お試しください。 仕手・仕手株・仕手筋とは?

[お知らせ]
リアルタイム注目キーワードランキング をホームに設置しました。2ch市況1/株式板で今リアルタイムで話題の注目キーワードをご覧ください。 ※現在1位のキーワードは『トランプ』です
本日、仕手株として話題になっている銘柄は 仕手・仕手株 こちらの検索結果をご参考に。

【4631】DIC【4631】

1 : 管理人 : 2012/07/30(月) 20:32:49 ID:OwnerKabu685

DIC[4631] - 国内インキ2位、米欧インキ会社サンケミカルを傘下に収め世界市場は首位。インキ以外は樹脂を中心とした工業材料事業、プラスチック成型品等の機能製品事業、電子情報材料事業など多彩な展開。インキのアジア、東欧での需要取り込みや、工業材料の中国での販売拡大、液晶等の次世代製品・事業の早期戦略化に注力。欧米の工業材料事業子会社を売却するなどリストラを進める一方、インキの世界最適生産体制構築など再編を積極推進。

会社HP:ttp://www.dic-global.com/

前へ次へ

現在書き込みはありません。
DICを保有している方や思惑のある方は、ぜひ書き込みして行ってください!

DICの銘柄情報はコチラ→4631

[4631]DIC 2ch&Yahoo板統合 新着口コミ情報

※コメントは常に更新されます

Yahoo掲示板(Y板) - 4631より

501 :投資しようとは思えな…:2025/05/07(水)21:31:00 ID: 忍

投資しようとは思えない

Yahoo掲示板(Y板) - 4631より

500 :すごいレベルの高そう…:2025/05/07(水)19:01:00 ID:膜綴じ

すごいレベルの高そうな会社やな。

Yahoo掲示板(Y板) - 4631より

499 :損切り視野に。:2025/05/07(水)13:08:00 ID:運 国際

損切り視野に。いらない優待。ゴミ箱へ。サプリの押し売り。メルカリ、ヤフオクでも余り現象。 一番深井な持ち株。売って清々したい。

Yahoo掲示板(Y板) - 4631より

498 :どこかにTOBでも仕…:2025/05/02(金)12:26:00 ID:y42*****

どこかにTOBでも仕掛けられてくれないかな。価値のある美術品ありますよ。

Yahoo掲示板(Y板) - 4631より

497 :経費使い過ぎの割りに…:2025/05/02(金)03:26:00 ID:965*****

経費使い過ぎの割りにリターン力に乏しい生産技術・R&D・新事業が 今の状況のままでは、新利益創出による成長ができないからしんどい。

Yahoo掲示板(Y板) - 4631より

496 :中途半端に六本木なん…:2025/05/01(木)22:18:00 ID:ちょうきんぺい

中途半端に六本木なんかに美術館を残すから悪いんだよ カレンダーは前にも投稿したがフリマで400円で捌くのがやっとだった あと一般個人の知名度が上がっても川上の企業だから業績とかに関係ないよ DICを一般人に読ませたら半数以上が「ディック」だよ その程度の会社ってこと

Yahoo掲示板(Y板) - 4631より

495 :BtoBの企業で、:2025/05/01(木)10:37:00 ID:san*****

BtoBの企業で、一般個人に知名度がないからこそ、個人向けの優待カレンダーくらいは残すべきだと私も思っていました。 使っているインキは自社製品なんだからPRにもなるし。 美術館縮小の件といい、がっかりではあります。 ま、資本効率を高めろという株主もいるわけで、株価上昇に期待(そうしたら売却する予定)していますが、 今のところそっちの方もサッパリだめでは、踏んだり蹴ったり。

Yahoo掲示板(Y板) - 4631より

494 ::2025/04/30(水)21:59:00 ID:old*****

太陽ホールディングスさん買ってください

Yahoo掲示板(Y板) - 4631より

493 :毎年、:2025/04/30(水)15:32:00 ID:ちょうきんぺい

毎年、オークションに500円くらいで出品されてましたね 価格相応。。な株主優待

Yahoo掲示板(Y板) - 4631より

492 :カレンダーだけは残し…:2025/04/30(水)14:53:00 ID:4ad*****

カレンダーだけは残して欲しいと願う株主です。 色・センス良く、さすがインキ屋さんと、毎年楽しみにしていたのに…

【急騰】今買えばいい株22208【団鬼六】 より

536 :山師さん:2025/04/21(月)22:53:54 ID:fbXSdLse

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

547 :山師さん:2025/04/21(月)23:01:35 Rfp0DKa2

>>536
荒らすなボケ!

【急騰】今買えばいい株22208【団鬼六】 より

528 :山師さん:2025/04/21(月)22:51:37 ID:HQwTJw7C

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【急騰】今買えばいい株22208【団鬼六】 より

527 :山師さん:2025/04/21(月)22:51:14 ID:N5bUdpKO

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【急騰】今買えばいい株22208【団鬼六】 より

526 :山師さん:2025/04/21(月)22:51:03 ID:+p5wlGn+

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

【急騰】今買えばいい株22208【団鬼六】 より

521 :山師さん:2025/04/21(月)22:50:11 ID:rwHZuuRz

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

続きは4631銘柄情報ページでご確認ください

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(参考:2ちゃんねる全板・勢いランキング

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