【3648】ＡＧＳ【3648】
1 : 管理人 : 2012/07/30(月) 20:26:47 ID:OwnerKabu685
ＡＧＳ［3648］ - １９７１年、協和銀行、埼玉銀行の情報システム会社としてそれぞれ出発。親会社の統合により、りそな傘下に。２００４年りそなグループの連結対象から外れるが、売上高比率が３０％を超える主要顧客。依存度低下が課題。データセンター事業が中核で、運用・管理サービスを強化。ソフトウェアは法人向け常駐開発が主力。受託計算サービスなども行う。データセンター事業拡大に注力、１２年４月の新センター稼働を目指す。
会社HP：ttp://www.ags.co.jp/
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ＡＧＳを保有している方や思惑のある方は、ぜひ書き込みして行ってください！
ＡＧＳの銘柄情報はコチラ→3648
［3648］ＡＧＳ 2ch&Yahoo板統合 新着口コミ情報
※コメントは常に更新されます
Yahoo掲示板（Y板） - 3648より
687 :ノンホルダーですが、…：2025/05/06(火)15:47:00 ID:ビナミルク
【急騰】今買えばいい株22241【石破減配祭り】 より
579 :山師さん：2025/04/30(水)13:51:48 ID:oolPhORB
3648特売り
【急騰】今買えばいい株22208【団鬼六】 より
536 :山師さん：2025/04/21(月)22:53:54 ID:fbXSdLse
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
547 :山師さん：2025/04/21(月)23:01:35 Rfp0DKa2
>>536
荒らすなボケ！
【急騰】今買えばいい株22208【団鬼六】 より
528 :山師さん：2025/04/21(月)22:51:37 ID:HQwTJw7C
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
527 :山師さん：2025/04/21(月)22:51:14 ID:N5bUdpKO
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
526 :山師さん：2025/04/21(月)22:51:03 ID:+p5wlGn+
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
【急騰】今買えばいい株22208【団鬼六】 より
521 :山師さん：2025/04/21(月)22:50:11 ID:rwHZuuRz
Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.
The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.
TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.
TSMC Advances FOPLP Technology
Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.
The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.
As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.
Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion
Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.
Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.
As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.
In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.
Yahoo掲示板（Y板） - 3648より
686 :一言で、：2025/04/21(月)13:41:00 ID:とらとらとら
一言で、言えば…社員を大切にしない企業だからおすすめできません。 私は…多くの企業の立て直しをしてきました。そこで問題の多い企業の多くが社員が不満を抱えて働いている点でした。 「ＥＳなくしてＣＳなし」と言うのが私が出した結論です。 生活に余裕も無く不安に苛まれ不幸な社員が、お客様の幸福を真剣に考えられるはずが無いと言うことです。 お客様に見限られれば、当然その企業は衰退して行きます。 従業員を大切にする企業と出会えることを祈念しております。 >就職を考えているのですがやめたほうが良いでしょうか？ そこまでボロクソに言う理由を教えてください。
Yahoo掲示板（Y板） - 3648より
685 :：2025/04/17(木)16:21:00 ID:で～とれ連邦準備制度
Yahoo掲示板（Y板） - 3648より
682 :絶対に就職は辞めた方…：2025/04/17(木)01:39:00 ID:とらとらとら
絶対に就職は辞めた方が良いです。 問題点： ①生涯年収が上場企業のソレを大きく下回っており、一馬力での生活は不可能なこと。 車買えない、家庭持てない、家買えない…。 ②賢い若者ほど短期間で離職しています。ということは、履歴書を汚すだけです。 ③健康経営宣言との看板を掲げていた時もありますが、要はホワイト企業をアピールしていながら…その実、適切な残業の割増賃金も支払われていません。 ④ＩＴ企業と言いながら、開発力が乏しく他社製品のOEMに頼っているなど恥ずかしい限り。 自社でも…給与計算ソフトを扱っておりながら、給与計算ミスを起こす。しかし、謝罪もせずに時効の援用を恥ずかしげもなく訴える会社であること。 年末調整は勘◯奉行を使用している点…社員は完全に白けています。 ⑤歴代の社長はりそな銀行からの天下り。りそなの利益を第一にAGS社の業務単価を上げることもできない。背任行為にも見える。 それ故、自浄作用が期待できない。 株式投資ならご自身の判断でご自由に…と言いますが。 就職となれば、親御さんの期待なども背負っていらっしゃるのでは？ だからこそ、絶対に辞めた方が良いと言い切ります。 この会社が向く人→実家住まいで小遣いだけ稼げれば良い人のみ。 >就職を考えているのですがやめたほうが良いでしょうか？ そこまでボロクソに言う理由を教えてください。
Yahoo掲示板（Y板） - 3648より
681 :株式投資は、：2025/04/16(水)22:01:00 ID:YaHoo
株式投資は、個人が企業の成長に参加し、利益を得るための有力な手段です。しかし、投資を始める前にその仕組みやメリットを理解することが重要です。ここでは、株式投資の基本について解説いたします。 株式とは何か？ 株式とは、企業が資金を調達するために発行する証券であり、株主はその企業の一部を所有する権利を持ちます。株主は、企業の利益に応じて配当を受け取ることができ、また株価の上昇によってキャピタルゲインを得ることも可能です。 株式投資のメリット 1. **資本成長の可能性**：企業が成長し、業績が向上することで株価が上昇する可能性があります。これにより、投資家は資産を増やすことができます。 2. **配当収入**：企業が利益を上げると、定期的に配当を支払うことがあります。これにより、定期的な収入源を確保することができます。 3. **経済成長への貢献**：株式投資を通じて、投資家は企業の成長を支援し、ひいては経済全体の発展に寄与することができます。 リスクと注意点 株式投資にはリスクも伴います。市場の変動や経済状況によって株価が下落する可能性があり、元本割れのリスクも存在します。そのため、十分な情報収集と分析が必要です。 詳細情報を得るには さらに詳しい情報や具体的な投資方法について知りたい方は、LINEでの情報提供サービスをご利用ください。LINE ID：
Yahoo掲示板（Y板） - 3648より
680 :祝：2025/04/16(水)15:36:00 ID:神降臨
祝
Yahoo掲示板（Y板） - 3648より
678 :株探ニュース会社側か…：2025/04/15(火)17:25:00 ID:RA168E
株探ニュース 会社側からの【修正の理由】 当社は、株主の皆様への利益還元を経営の重要課題の一つと位置づけ、経営基盤の強化、今後の事業の拡充、連結業績等を勘案しながら、配当性向30％を目安に、安定した利益配分を行っていくことを基本方針としております。 2025年１月29日公表の「業績予想の修正に関するお知らせ」にて修正いたしました通期連結業績予想のとおり、過去最高の業績となる見通しであることから、»続く 上記方針を踏まえて期末配当予想を当初予想の１株当たり８円から８円増配の16円に修正いたします。
続きは3648銘柄情報ページでご確認ください
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週刊SPA！7／24・31合併号のマネー(得)総本部のコーナーで当サイト『恐るべき注目銘柄株速報』のインタビュー記事が掲載されました。
ノンホルダーですが、再エネ注力の方針を転換して欲しく思います。 「2030年までに再エネ100%を目指す」というのがなければ、優待なども魅力的で買いたい銘柄です。