------ BNRスピードテスト (ダウンロード速度) ------
測定サイト： https://www.musen-lan.com/speed/ Ver10.0069
測定日時： 2025年05月06日(火) 08時43分11秒
--------------------------------------------------
SAKURA：201.89Mbps (25.24MB/sec)
WebArena：532.96Mbps (66.62MB/sec)
データ転送速度： 532.96Mbps (66.62MB/sec)　

------ BNRスピードテスト (ダウンロード速度) ------
測定サイト： https://www.musen-lan.com/speed/ Ver10.0069
測定日時： 2025年05月06日(火) 08時42分27秒
--------------------------------------------------
SAKURA：91.05Mbps (11.38MB/sec)
WebArena：90.34Mbps (11.29MB/sec)
データ転送速度： 91.05Mbps (11.38MB/sec)

ほう(´・ω・｀)

------ BNRスピードテスト (ダウンロード速度) ------
測定サイト： https://www.musen-lan.com/speed/ Ver10.0069
測定日時： 2025年05月06日(火) 08時40分15秒
--------------------------------------------------
SAKURA：10.74Mbps (1.34MB/sec)
WebArena：9.67Mbps (1.21MB/sec)
データ転送速度： 10.74Mbps (1.34MB/sec

速くね(´・ω・｀)

一定の補償

楽天証券@RakutenSec
【今般の不正取引被害に対する当社の補償方針について】
午後3:48 · 2025年5月2日

https://pbs.twimg.com/media/Gp7NC6qawAI1lH2.jpg
https://x.com/RakutenSec/status/1918195950587441214

White House Press Sec Leavitt: Amazon Announcement Was Hostile
ホワイトハウスのリービット報道官：アマゾンの発表は敵対的だった

なんか知らんけど米国内でケンカだケンカだー(´・ω・｀)

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

Amid Trump’s tariffs, TSMC has been stepping up its investment in the U.S. According to Economic Daily News, the company is accelerating the timeline for its second Arizona fab. In addition, TSMC is reportedly set to introduce its latest fan-out panel-level packaging (FOPLP) technology in the U.S. to meet rising demand from customers seeking chips manufactured in the U.S.

The report highlights that, following major clients such as Apple, NVIDIA, and AMD announcing plans to expand their investments in the U.S., TSMC has accordingly adjusted its strategies.

TSMC is currently in its quiet period ahead of its earnings call and is unable to comment, as the report notes.

TSMC Advances FOPLP Technology

Citing Nikkei, the report states that TSMC is finalizing the specifications for its FOPLP technology in an effort to accelerate its mass production timeline. The first-generation version is expected to adopt a 300mm x 300mm panel size—smaller than the previously tested 510mm x 515mm format. According to the report, TSMC is currently building a pilot production line in Taoyuan, Taiwan, with limited trial production anticipated to begin as early as 2027.

The report also notes that TSMC initially explored partnering with panel makers such as Innolux but ultimately opted to develop the technology in-house, as the current precision and technical capabilities of the panel industry were deemed insufficient to meet TSMC’s standards.

As noted by the report, FOPLP offers improved heat dissipation compared to 3D stacking techniques such as wafer-on-wafer (WoW), CoWoS, and SoIC. However, its production efficiency is lower than that of existing 3D stacking methods. The report adds that AI customers are still expected to be the primary adopters of this packaging technology.

Tech Giants Fuel TSMC’s U.S. Manufacturing Expansion

Notably, on April 15, AMD CEO Lisa Su confirmed that the company is ramping up U.S. production. According to Reuters, AMD’s flagship chips will soon roll off TSMC’s new Arizona line—marking the first time its products will be manufactured in the U.S.

Meanwhile, NVIDIA recently also revealed plans to invest up to USD 500 billion in U.S.-based AI server production over the next four years and confirmed that its Blackwell chips are now being produced at TSMC’s Phoenix plant, as Reuters notes.

As noted by Economic Daily News, sources indicate that in response to requests from major clients such as AMD and Apple, TSMC has reportedly informed suppliers that equipment move-in for its second Arizona fab will begin as early as September this year—one full year ahead of schedule.

In other words, the fab’s 3nm production is now expected to begin by the end of 2027, while the second-phase line for 2nm is projected to enter mass production in 2028 as the report points out.

5304で損切ったアドバンを5334で再度300買い
すぐやられるだろ

「Secure multi-party computation」とか「秘匿マルチパーティ計算」とか「秘密　MPC」とかぐぐってみろ
秘密計算の企業なんて腐るほどある

【速報】 米国、中国に245％の関税　中国以外の国の高関税は一時停止 ★3
https://asahi.5ch.net/test/read.cgi/newsplus/1744805008/1
1: お断り ★ 2025/04/16(水) 21:03:28.69 ID:8nf12XOb9
Today, President Donald J. Trump signed an Executive Order launching an investigation into the national security risks posed by U.S. reliance on imported processed critical minerals and their derivative products.
本日、トランプ大統領は米国が加工された重要鉱物とその派生製品の輸入に依存していることがもたらす国家安全保障上のリスクについて調査開始する大統領令に署名を行った。

As a result, the individualized higher tariffs are currently paused amid these discussions, except for China, which retaliated.
報復措置を取った中国を除き、個別の高関税の導入は協議が続く中で現在一時停止している。

China now faces up to a 245% tariff on imports to the United States as a result of its retaliatory actions.
中国は報復措置の結果、米国への輸入品に最大245％の関税を課す。

ホワイトハウス公式 (現地時間)2025/4/15 ソース英語『Fact Sheet: President Donald J. Trump Ensures National Security and Economic Resilience Through Section 232 Actions on Processed Critical Minerals and Derivative Products』
https://www.whitehouse.gov/fact-sheets/2025/04/fact-sheet-president-donald-j-trump-ensures-national-security-and-economic-resilience-through-section-232-actions-on-processed-critical-minerals-and-derivative-products/

ZenmuTechのオンリーワン煽りはハメコミだぞ
秘密計算の企業なんてちょっとググるだけでこんなにあるからな
騙されるなよ

秘匿マルチパーティ計算（SMPC）市場| 市場規模 市場調査 予測 2029年まで
https://www.gii.co.jp/report/mama1497428-secure-multiparty-computation-smpc-market-by.html

主要参入企業
MICROSOFT
IBM
GOOGLE
FIREBLOCKS
BLOCKDAEMON
QREDO
PENTA SECURITY
ZENGO
INPHER
CYBAVO
LIMINAL CUSTODY
SPATIUM
SILENCE LABORATORIES
KRAYON DIGITAL
ATATO
WEB3AUTH
PARTISIA BLOCKCHAIN
OROCHI NETWORK
BINANCE
PYTE
ROSEMAN LABS
MPCVAULT
DUOKEY
LINKSIGHT
HYPERBC

秘密計算に取り組む企業まとめ（MPC編）
https://acompany.tech/privacytechlab/companies-work-on-multi-party-computation

海外企業： inpher、Partisia、 Sepior、 TNO、 Unbound Tech

国内企業： Acompany、NEC、 NTT

【 AI解析×秘密計算のEAGLYS】Microsoft for Startupsに採択 | EAGLYS 株式会社のプレスリリース

Forget tariffs — Beijing is already choking off US exports on the sly
China juices trade war with nontariff barriers targeting MAGA-friendly U.S. export sectors.（POLITICO）

関税は忘れよ - 北京はすでに密かに米国の輸出を締め出している
中国はMAGAに友好的な米国の輸出部門を標的にした非関税障壁で貿易戦争を仕掛けている。

そう言う事でしたか・・・(´・ω・`)

ZenmuTechのオンリーワン煽りはハメコミだぞ
秘密計算の企業なんてちょっとググるだけでこんなにあるからな
騙されるなよ

秘匿マルチパーティ計算（SMPC）市場| 市場規模 市場調査 予測 2029年まで
https://www.gii.co.jp/report/mama1497428-secure-multiparty-computation-smpc-market-by.html

主要参入企業
MICROSOFT
IBM
GOOGLE
FIREBLOCKS
BLOCKDAEMON
QREDO
PENTA SECURITY
ZENGO
INPHER
CYBAVO
LIMINAL CUSTODY
SPATIUM
SILENCE LABORATORIES
KRAYON DIGITAL
ATATO
WEB3AUTH
PARTISIA BLOCKCHAIN
OROCHI NETWORK
BINANCE
PYTE
ROSEMAN LABS
MPCVAULT
DUOKEY
LINKSIGHT
HYPERBC

秘密計算に取り組む企業まとめ（MPC編）
https://acompany.tech/privacytechlab/companies-work-on-multi-party-computation

海外企業： inpher、Partisia、 Sepior、 TNO、 Unbound Tech

国内企業： Acompany、NEC、 NTT

【 AI解析×秘密計算のEAGLYS】Microsoft for Startupsに採択 | EAGLYS 株式会社のプレスリリース